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ADCS7476AISDX

Texas Instruments

ADCS7476AISDX by Texas Instruments

The Texas Instruments ADCS7476AISDX is a 12-bit ADC with 0.0244% linearity error, 1 MHz sample rate, and 3V supply voltage. Ideal for automotive applications, it features a small outline package with a max operating temperature of 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,670 parts In-Stock

1+ parts

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8,670

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Digiode

USA . 1,788 parts In-Stock

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1,788

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Anansix

USA . 278 parts In-Stock

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278

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 513 parts In-Stock

1+ parts

$15.373

100+ parts

-

1k+ parts

$15.760

10k+ parts

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513

$15.373

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$15.760

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DigiPath Technology Company

USA . 1,888 parts In-Stock

1+ parts

$16.928

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1,888

$16.928

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IDEA Electronic Components Group

UK . 1,613 parts In-Stock

1+ parts

$17.273

100+ parts

$16.409

1k+ parts

$15.546

10k+ parts

-

1,613

$17.273

$16.409

$15.546

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ChromeModa Solutions

Germany . 1,565 parts In-Stock

1+ parts

$17.273

100+ parts

$14.164

1k+ parts

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10k+ parts

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1,565

$17.273

$14.164

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AZTECH Wire

Italy . 707 parts In-Stock

1+ parts

$18.320

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707

$18.320

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One Stop Electronics

USA . 469 parts In-Stock

1+ parts

$20.000

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469

$20.000

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Corphita

USA . 4,161 parts In-Stock

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4,161

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Native Components

USA . 756 parts In-Stock

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756

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Northwest PG Solutions

USA . 52 parts In-Stock

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52

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Overview

Unlock the power of precise data conversion with the Texas Instruments ADCS7476AISDX Analog-to-Digital Converter. Crafted with expertise by a leading manufacturer in the industry, this high-quality device offers unparalleled accuracy and reliability for a wide range of applications. From automotive to industrial settings, this converter provides fast and efficient data processing, ensuring optimal performance every time. Experience the value and benefits of seamless integration and superior functionality with the ADCS7476AISDX. Elevate your projects with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and reliability for the converter, making it a good choice for long-term use.

No. of Bits: 12

Having 12 bits allows for high-resolution conversion, resulting in more accurate digital representation of analog signals.

Maximum Linearity Error (EL): 0.0244 %

Low linearity error ensures accurate conversion, making this converter suitable for precision measurement applications.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature range ensures the converter can operate reliably in harsh automotive environments, making it a good choice for automotive applications.

Sample Rate: 1 MHz

High sample rate allows for fast and efficient conversion of analog signals, making this converter suitable for high-speed applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this converter energy-efficient and reliable.

Technical Specifications

Analog-to-Digital Converters ADCS7476AISDX attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

1 MHz

Hold Mode:

Track

Maximum Conversion Time:

1 µs

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

40 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

6

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.087 in (2.2 mm)

Length:

0.098 in (2.5 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e0

Trade Compliance

ADCS7476AISDX Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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