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ADCS7477AIMFE

Texas Instruments

ADCS7477AIMFE by Texas Instruments

The Texas Instruments ADCS7477AIMFE is a 10-bit ADC with 0.0684% EL, 1us conversion time, and 1MHz sample rate. Ideal for industrial applications, it features a CMOS technology, operates b/w -40 to 85 °C, and has a small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,663 parts In-Stock

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Anansix

USA . 1,758 parts In-Stock

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1,758

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Digiode

USA . 827 parts In-Stock

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827

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Distributors (Availability)

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AZTECH Wire

Italy . 581 parts In-Stock

1+ parts

$14.577

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581

$14.577

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One Stop Electronics

USA . 1,611 parts In-Stock

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$23.000

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$23.000

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Parana Technologies

USA . 1,103 parts In-Stock

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$24.493

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$25.155

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1,103

$24.493

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$25.155

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ChromeModa Solutions

Germany . 6,535 parts In-Stock

1+ parts

$27.520

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$22.566

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6,535

$27.520

$22.566

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IDEA Electronic Components Group

UK . 243 parts In-Stock

1+ parts

$27.520

100+ parts

$26.144

1k+ parts

$24.768

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243

$27.520

$26.144

$24.768

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Corphita

USA . 4,976 parts In-Stock

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4,976

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DigiPath Technology Company

USA . 1,377 parts In-Stock

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$24.812

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$24.812

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Northwest PG Solutions

USA . 629 parts In-Stock

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Native Components

USA . 566 parts In-Stock

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566

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Overview

Experience unparalleled precision and performance with the ADCS7477AIMFE by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Analog-to-Digital Converters to meet your needs. From industrial automation to medical devices, this converter offers exceptional value with its fast conversion time, high linearity accuracy, and compact design. Trust Texas Instruments for quality products that excel in a wide range of applications, providing you with the reliability and efficiency you deserve. Elevate your projects with the ADCS7477AIMFE and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight yet durable housing for the converter.

No. of Bits: 10

Offers a high resolution for accurate conversion.

Maximum Linearity Error (EL): 0.0684 %

Ensures precise and reliable conversion results.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where higher temperatures may be present.

Technology: CMOS

Utilizes low power consumption and provides fast conversion speeds.

Nominal Supply Voltage: 3 V

Works efficiently with a common nominal supply voltage.

Technical Specifications

Analog-to-Digital Converters ADCS7477AIMFE attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

10

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0684 %

Sample Rate:

1 MHz

Hold Mode:

Track

Maximum Conversion Time:

1 µs

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

6

Terminal Form:

Terminal Pitch:

0.037 in (0.95 mm)

Surface Mount:

Yes

Width:

0.063 in (1.6 mm)

Length:

0.115 in (2.92 mm)

Maximum Seated Height:

0.048 in (1.22 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSOP6,.11,37

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e0

Trade Compliance

ADCS7477AIMFE Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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