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ADCS7476AIMFE

Texas Instruments

ADCS7476AIMFE by Texas Instruments

The Texas Instruments ADCS7476AIMFE is a 12-bit ADC with 0.0244% EL, 1us conversion time, and 1MHz sample rate. Ideal for automotive applications, it operates b/w -40 to 125°C, with a max analog input voltage of 5.25V.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,147 parts In-Stock

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6,147

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VNN

France . 5,537 parts In-Stock

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5,537

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Digiode

USA . 3,933 parts In-Stock

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3,933

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Anansix

USA . 612 parts In-Stock

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612

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 202 parts In-Stock

1+ parts

$8.672

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202

$8.672

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AZTECH Wire

Italy . 629 parts In-Stock

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$11.024

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629

$11.024

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Parana Technologies

USA . 2,195 parts In-Stock

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$12.491

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$12.931

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2,195

$12.491

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$12.931

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DigiPath Technology Company

USA . 2,073 parts In-Stock

1+ parts

$13.754

100+ parts

$12.654

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2,073

$13.754

$12.654

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ChromeModa Solutions

Germany . 6,168 parts In-Stock

1+ parts

$14.035

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$11.509

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6,168

$14.035

$11.509

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IDEA Electronic Components Group

UK . 832 parts In-Stock

1+ parts

$14.035

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$13.333

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$12.632

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832

$14.035

$13.333

$12.632

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Ampacity Inc.

Singapore . 178 parts In-Stock

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$16.000

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178

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One Stop Electronics

USA . 575 parts In-Stock

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$18.000

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575

$18.000

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Semicontronic

India . 370 parts In-Stock

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$18.000

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$17.550

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$17.460

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370

$18.000

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Corohmni

South Africa . 9 parts In-Stock

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$18.062

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9

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Continental Prestige Electronics

USA . 6,791 parts In-Stock

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Corphita

USA . 4,758 parts In-Stock

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4,758

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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3,500

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Argo Parts USA

USA . 429 parts In-Stock

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429

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Experience unparalleled precision and reliability with the Texas Instruments ADCS7476AIMFE Analog-to-Digital Converter. Crafted by a trusted manufacturer, this high-quality device is designed for automotive applications, ensuring optimum performance in demanding environments. With fast conversion times and low linearity error, this converter offers exceptional value to customers looking for accurate data acquisition solutions. Upgrade your system with the ADCS7476AIMFE and unlock new possibilities in measurement and control.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this ADC lightweight and durable, ideal for portable devices.

Surface Mount: YES

This surface mount option allows for easy and secure installation on circuit boards, saving space and reducing manufacturing costs.

Package Shape: RECTANGULAR

The rectangular package shape ensures compatibility with standard PCB layouts and simplifies the mounting process.

No. of Bits: 12

With 12 bits of resolution, this ADC can provide highly accurate digital conversions, making it suitable for precision measurement applications.

Maximum Linearity Error (EL): 0.0244%

The low linearity error ensures accurate conversion of analog signals to digital, making this ADC reliable for critical data acquisition tasks.

No. of Terminals: 6

The compact design with 6 terminals allows for easy integration into tight spaces, making it a versatile choice for various electronic devices.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This small outline, low profile package style with shrink pitch makes it suitable for space-constrained applications while maintaining high performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range allows this ADC to perform reliably in harsh environments, making it suitable for industrial and automotive use.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this ADC can withstand cold environments, making it suitable for outdoor applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent conductivity and solderability, ensuring stable connections and reliable performance.

Terminal Position: DUAL

The dual terminal position design enhances stability and reliability of connections, making this ADC suitable for rugged applications.

Maximum Conversion Time: 1 us

With a fast maximum conversion time of 1 microsecond, this ADC can quickly process analog signals, making it ideal for real-time data acquisition systems.

Maximum Seated Height: 1.22 mm

The low maximum seated height allows for compact integration into electronic devices, making this ADC suitable for miniaturized designs.

Width: 1.6 mm

The slim width of this ADC enables easy placement on circuit boards with minimal space requirements, enhancing overall system design flexibility.

Length: 2.92 mm

The short length of this ADC makes it suitable for compact electronic devices, where space is limited, without compromising performance.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this ADC can withstand extreme temperature fluctuations and harsh operating conditions, ensuring reliable performance on the road.

Maximum Analog Input Voltage: 5.25 V

The high maximum analog input voltage range allows this ADC to accommodate a wide range of signal inputs, making it versatile for various sensor applications.

Sample Rate: 1 MHz

With a fast sample rate of 1 MHz, this ADC can capture and convert analog signals quickly, making it suitable for high-speed data acquisition systems.

Technology: CMOS

The CMOS technology used in this ADC offers low power consumption and high noise immunity, making it energy-efficient and reliable for long-term operation.

Terminal Form: GULL WING

The gull wing terminal form provides a secure and reliable connection, making this ADC suitable for applications where vibration or movement may occur.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation conversion method used in this ADC offers high resolution and fast conversion times, making it ideal for accurate signal processing.

Nominal Supply Voltage: 3 V

With a nominal supply voltage of 3 volts, this ADC can operate efficiently with low power consumption, making it suitable for battery-powered devices.

Output Bit Code: BINARY

The binary output bit code simplifies data processing and interpretation, making this ADC compatible with standard digital systems.

Terminal Pitch: 0.95 mm

The small terminal pitch allows for tight spacing on the PCB, enabling efficient use of board real estate and enhancing overall system compactness.

Minimum Analog Input Voltage: 0 V

The low minimum analog input voltage range allows this ADC to accurately detect and convert small signals, making it suitable for sensor applications with low voltage outputs.

Output Format: SERIAL

The serial output format simplifies data transmission and integration with digital systems, making this ADC versatile for a wide range of applications.

Sample and Hold/Track and Hold: TRACK

The track sample and hold feature ensures accurate and stable signal conversion, making this ADC reliable for dynamic signal processing tasks.

Technical Specifications

Analog-to-Digital Converters ADCS7476AIMFE attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

1 MHz

Hold Mode:

Track

Maximum Conversion Time:

1 µs

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

6

Terminal Form:

Terminal Pitch:

0.037 in (0.95 mm)

Surface Mount:

Yes

Width:

0.063 in (1.6 mm)

Length:

0.115 in (2.92 mm)

Maximum Seated Height:

0.048 in (1.22 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSOP6,.11,37

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e0

Trade Compliance

ADCS7476AIMFE Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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