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76005012X

Texas Instruments

76005012X by Texas Instruments

Texas Instruments 76005012X is a TTL decoder with 20 terminals, operating b/w -55 to 125 °C. It has a propagation delay of 64 ns at 5V, load capacitance of 15 pF, and can handle up to 8 Amp output current. Ideal for military applications due to its ceramic-metal package and inverted output polarity.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 3,749 parts In-Stock

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Vyrian

USA . 2,567 parts In-Stock

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Anansix

USA . 1,035 parts In-Stock

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AZTECH Wire

Italy . 206 parts In-Stock

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$10.067

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Parana Technologies

USA . 751 parts In-Stock

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ChromeModa Solutions

Germany . 5,064 parts In-Stock

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IDEA Electronic Components Group

UK . 2,030 parts In-Stock

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$18.462

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$17.491

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One Stop Electronics

USA . 2,372 parts In-Stock

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UNI Independent Distributors

Spain . 5,458 parts In-Stock

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Northwest PG Solutions

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DigiPath Technology Company

USA . 2,302 parts In-Stock

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Corphita

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Native Components

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Overview

Experience superior quality and reliability with the 76005012X from Texas Instruments, a leading manufacturer in the industry. This versatile decoder & driver chip offers unmatched performance, perfect for a wide range of applications. With fast propagation delay and high I (ol) capability, this chip ensures efficient operation at both low and high temperatures. Trust in Texas Instruments to deliver top-notch products like the 76005012X, providing customers with exceptional value and cutting-edge technology for all their decoding and driving needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed materials ensures durability and reliability of the product.

Propagation Delay At Nominal Supply: 12 ns

Low propagation delay ensures fast processing and quick response times.

Surface Mount: YES

Being surface mountable makes installation and integration easy and efficient.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level of 5V, compatible with most systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for a variety of environments.

Technology: TTL

Uses TTL technology known for its reliability and compatibility with a wide range of systems.

Technical Specifications

Decoder & Drivers 76005012X attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

3 ENABLE INPUTS

Family:

LS

Input Conditioning:

STANDARD

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT APPLICABLE

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

64 ns

Qualification:

Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT APPLICABLE

Width:

8.89 mm

Trade Compliance

76005012X Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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