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7600701FA

Texas Instruments

7600701FA by Texas Instruments

The Texas Instruments 7600701FA is a TTL technology decoder & driver with 4-bit input, 2 functions, and inverted output polarity. It has a propagation delay of 53ns at 5V supply voltage, suitable for military-grade applications requiring MIL-STD-883 screening. This surface-mount device in flatpack style operates b/w -55°C to 125°C temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,734 parts In-Stock

1+ parts

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7,734

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Digiode

USA . 2,762 parts In-Stock

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2,762

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Distributors (Availability)

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Native Components

USA . 685 parts In-Stock

1+ parts

$0.993

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685

$0.993

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Northwest PG Solutions

USA . 1,648 parts In-Stock

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$1.092

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1,648

$1.092

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AZTECH Wire

Italy . 438 parts In-Stock

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$5.489

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438

$5.489

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One Stop Electronics

USA . 260 parts In-Stock

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$17.000

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260

$17.000

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Parana Technologies

USA . 947 parts In-Stock

1+ parts

$19.498

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$19.507

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947

$19.498

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$19.507

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DigiPath Technology Company

USA . 28 parts In-Stock

1+ parts

$21.470

100+ parts

$19.752

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28

$21.470

$19.752

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ChromeModa Solutions

Germany . 2,341 parts In-Stock

1+ parts

$21.908

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$17.965

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$21.908

$17.965

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IDEA Electronic Components Group

UK . 797 parts In-Stock

1+ parts

$21.908

100+ parts

$20.813

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$19.717

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797

$21.908

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$19.717

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Microchip USA

USA . 3,661 parts In-Stock

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3,661

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Corphita

USA . 374 parts In-Stock

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374

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Overview

Unlock the power of precision and reliability with the Texas Instruments 7600701FA Decoder & Drivers. Designed with industry-leading technology and high-quality materials, this product offers unmatched performance and durability for a wide range of applications. Whether you're enhancing your electronics project or upgrading your military-grade systems, this decoder and driver deliver seamless operation and maximum efficiency. Trust Texas Instruments to provide superior solutions that exceed expectations. Elevate your projects with the 7600701FA and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 53 ns

Fast propagation delay allows for quick signal processing, making this decoder & driver efficient.

Surface Mount: YES

Ease of installation and space-saving design for modern electronic equipment.

No. of Functions: 2

Offers multiple functions in one component, saving space and simplifying circuit design.

Nominal Supply Voltage / Vsup (V): 5

Works with standard 5V power supplies, making it compatible with most electronic systems.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments, suitable for a wide range of applications.

Technology: TTL

Utilizes proven TTL technology for reliable and robust signal processing.

Technical Specifications

Decoder & Drivers 7600701FA attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

SCHOTTKY CLAMPED FOR HIGH PERFORMANCE

Family:

LS

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDFP-F16

JESD-609 Code:

e0

Length:

10.16 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

10 mA

Propagation Delay At Nominal Supply:

53 ns

Propagation Delay (tpd):

53 ns

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.03 mm

Sub-Category:

Decoder/Driver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.73 mm

Trade Compliance

7600701FA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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