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SN74F138DRE4

Texas Instruments

SN74F138DRE4 by Texas Instruments

SN74F138DRE4 by Texas Instruments is a TTL decoder with 9 ns propagation delay at 5V. It has inverted output polarity, operates b/w 0-70°C, and comes in a small outline package. Ideal for applications requiring fast decoding with standard input conditioning and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,394 parts In-Stock

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Digiode

USA . 1,983 parts In-Stock

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Nova Conductors

Japan . 870 parts In-Stock

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AZTECH Wire

Italy . 499 parts In-Stock

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$16.144

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Semicontronic

India . 1,224 parts In-Stock

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$22.000

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$21.450

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$21.340

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Ampacity Inc.

Singapore . 403 parts In-Stock

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$25.000

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Parana Technologies

USA . 1,148 parts In-Stock

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$25.539

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$26.156

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IDEA Electronic Components Group

UK . 2,012 parts In-Stock

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$28.695

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$27.260

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$25.826

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$28.695

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ChromeModa Solutions

Germany . 1,739 parts In-Stock

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$28.695

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$23.530

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One Stop Electronics

USA . 1,376 parts In-Stock

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$37.000

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Corphita

USA . 2,938 parts In-Stock

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Continental Prestige Electronics

USA . 1,029 parts In-Stock

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Argo Parts USA

USA . 770 parts In-Stock

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DigiPath Technology Company

USA . 763 parts In-Stock

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A-Z Elektronik GmbH

Germany . 644 parts In-Stock

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Kepictronics

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Enhance your electronic projects with the SN74F138DRE4 by Texas Instruments, a top-tier manufacturer known for quality and innovation. This versatile Decoder & Drivers component offers fast propagation delay and inverted output polarity, making it ideal for a wide range of applications. With a small outline package and standard input conditioning, this product delivers reliable performance while maximizing space efficiency. Trust Texas Instruments to provide high-value solutions that meet your needs with precision and excellence. Elevate your designs with the SN74F138DRE4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and provides good protection for the internal components of the decoder & driver.

Propagation Delay At Nominal Supply: 9 ns

Low propagation delay ensures fast response times and efficient data transmission.

Surface Mount: YES

Surface mount capability enables easy installation on circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making it easy to integrate into existing systems.

Load Capacitance (CL): 50 pF

Suitable for driving loads with a capacitance of up to 50 pF, ensuring compatibility with a wide range of devices.

Maximum Seated Height: 1.75 mm

Low profile design with a maximum seated height of 1.75 mm allows for compact and space-saving installations.

Temperature Grade: COMMERCIAL

Commercial grade temperature range of 0 to 70°C ensures reliable operation in standard operating conditions.

Technology: TTL

Utilizes TTL (Transistor-Transistor Logic) technology for reliable and robust signal processing.

Technical Specifications

Decoder & Drivers SN74F138DRE4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS

Family:

F/FAST

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

20 mA

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74F138DRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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