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74LVTH16501DLRG4

Texas Instruments

74LVTH16501DLRG4 by Texas Instruments

74LVTH16501DLRG4 by Texas Instruments is an 18-bit bus driver with a propagation delay of 3.7 ns at 3.3V, suitable for industrial applications. It features a small outline package, operates b/w -40 to 85°C, and supports independent control with a max supply voltage of 3.6V.

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 7,415 parts In-Stock

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Digiode

USA . 2,621 parts In-Stock

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2,621

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One Stop Electronics

USA . 1,527 parts In-Stock

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$3.000

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1,527

$3.000

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Andel Nordic

Denmark . 5,320 parts In-Stock

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$8.058

100+ parts

-

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$7.735

10k+ parts

$7.735

5,320

$8.058

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$7.735

$7.735

AZTECH Wire

Italy . 277 parts In-Stock

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$14.746

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277

$14.746

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Parana Technologies

USA . 386 parts In-Stock

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$16.542

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$16.820

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386

$16.542

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$16.820

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DigiPath Technology Company

USA . 441 parts In-Stock

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$18.214

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441

$18.214

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ChromeModa Solutions

Germany . 5,331 parts In-Stock

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$18.586

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$15.241

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5,331

$18.586

$15.241

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IDEA Electronic Components Group

UK . 192 parts In-Stock

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$18.586

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$17.657

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$16.727

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192

$18.586

$17.657

$16.727

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Native Components

USA . 184 parts In-Stock

1+ parts

$690.490

100+ parts

$676.680

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$669.775

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$662.870

184

$690.490

$676.680

$669.775

$662.870

Northwest PG Solutions

USA . 1,385 parts In-Stock

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$759.539

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Corphita

USA . 4,528 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,475 parts In-Stock

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Microchip USA

USA . 1,017 parts In-Stock

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Overview

Elevate your electronic designs with the 74LVTH16501DLRG4 from Texas Instruments, a leading manufacturer known for top-quality components. As part of the Bus Driver & Transceivers category, this product offers reliable performance and seamless integration into a variety of applications. With a nominal supply voltage of 3.3V and 18 bits, this component delivers fast propagation delay and 3-state output characteristics. Trust in Texas Instruments to provide innovative solutions that meet your needs and exceed your expectations. Upgrade your projects with the 74LVTH16501DLRG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the package lightweight and durable, making it easy to handle and resistant to damage.

Propagation Delay At Nominal Supply: 3.7 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed data communication applications.

Surface Mount: YES

Surface mount installation makes the product easy to integrate into circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on circuit boards, optimizing space utilization.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard nominal supply voltage of 3.3V, making it compatible with a wide range of electronic devices.

Load Capacitance (CL): 50 pF

Designed to work efficiently with a load capacitance of 50 pF, ensuring stable performance in various circuit configurations.

Power Supplies (V): 3.3

Compatible with power supplies operating at 3.3V, simplifying the power management aspects of the design.

No. of Terminals: 56

Ample number of terminals allow for versatile connectivity options, enabling flexible integration into complex circuit designs.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact package style with shrink pitch design saves space on the circuit board and facilitates tight layout constraints.

Maximum I (ol): 64 Amp

High output current capability of 64 Amp allows for driving demanding loads, enhancing the versatility of the product.

Propagation Delay (tpd): 5.7 ns

Fast propagation delay of 5.7 ns ensures quick signal transmission, reducing latency and improving overall system performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliable operation in harsh environments with elevated temperatures.

Output Characteristics: 3-STATE

3-STATE output configuration provides flexibility in controlling the output signal, allowing for tri-state logic implementation.

Trigger Type: POSITIVE EDGE

Positive edge trigger type ensures precise timing control of the output signal, critical for synchronous communication applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures reliable operation in cold environments, making the product suitable for diverse applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal finish of nickel/palladium/gold provides excellent corrosion resistance, ensuring long-term reliability of the electrical connections.

Terminal Position: DUAL

Dual terminal position allows for improved signal integrity and ease of assembly, enhancing the overall performance and reliability of the product.

No. of Ports: 2

Two ports enable bidirectional communication, facilitating versatile connectivity options in different circuit configurations.

Maximum Seated Height: 2.79 mm

Low maximum seated height of 2.79 mm minimizes the overall profile of the product, ideal for space-constrained applications.

Width: 7.49 mm

Compact width of 7.49 mm allows for efficient placement on the circuit board, maximizing space utilization and enabling tight layout designs.

Output Polarity: TRUE

True output polarity ensures accurate signal representation, essential for reliable communication in digital systems.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage requirement of 2.7V ensures compatibility with a wide range of power sources, enhancing the product's versatility.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures robust soldering performance during assembly processes, leading to reliable electrical connections.

Length: 18.415 mm

Optimal length of 18.415 mm allows for efficient placement on the circuit board, contributing to a streamlined and compact overall design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in demanding industrial environments, making the product suitable for rugged applications.

Technology: BICMOS

Utilizes BiCMOS technology, combining the advantages of bipolar and CMOS technologies for improved performance, efficiency, and reliability.

Terminal Form: GULL WING

Gull wing terminal form provides enhanced mechanical stability and solder joint strength, ensuring long-term reliability in various operating conditions.

Packing Method: TR

TR packing method ensures safe and secure transportation and storage of the product, protecting it from damage and environmental factors.

Terminal Pitch: 0.635 mm

Fine terminal pitch of 0.635 mm enables high-density mounting on the circuit board, saving space and facilitating compact electronic designs.

Count Direction: BIDIRECTIONAL

Bidirectional count direction allows for versatile signal transmission and reception capabilities, enabling flexible usage in different communication protocols.

Control Type: INDEPENDENT CONTROL

Independent control type provides individual control over specific functions or channels, enhancing customization and adaptability in diverse applications.

Maximum Supply Voltage (Vsup): 3.6 V

Maximum supply voltage of 3.6V ensures safe operation within the specified voltage range, protecting the product from potential overvoltage conditions.

Maximum Power Supply Current (ICC): 5 mA

Low maximum power supply current of 5 mA minimizes power consumption, enhancing energy efficiency and reducing thermal dissipation in the system.

Technical Specifications

Bus Driver & Transceivers 74LVTH16501DLRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

18

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

3.7 ns

Propagation Delay (tpd):

5.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.49 mm

Trade Compliance

74LVTH16501DLRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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