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74LVTH162373ZQLR

Texas Instruments

74LVTH162373ZQLR by Texas Instruments

74LVTH162373ZQLR by Texas Instruments is a Bus Driver & Transceiver with 8 bits, 2 functions, and a propagation delay of 4.6 ns at 3.3V. It features a very thin profile grid array package and is ideal for industrial applications requiring true output polarity control with low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,765 parts In-Stock

1+ parts

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6,765

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Digiode

USA . 2,299 parts In-Stock

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2,299

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Sensible Micro Corp

USA . 545 parts In-Stock

1+ parts

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545

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ComSIT Distribution GmbH

Germany . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,770 parts In-Stock

1+ parts

$4.108

100+ parts

-

1k+ parts

$3.943

10k+ parts

$3.943

5,770

$4.108

-

$3.943

$3.943

AZTECH Wire

Italy . 596 parts In-Stock

1+ parts

$6.175

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596

$6.175

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Native Components

USA . 217 parts In-Stock

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$10.175

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217

$10.175

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Northwest PG Solutions

USA . 963 parts In-Stock

1+ parts

$11.193

100+ parts

$10.073

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963

$11.193

$10.073

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Parana Technologies

USA . 311 parts In-Stock

1+ parts

$22.058

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$22.632

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311

$22.058

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$22.632

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IDEA Electronic Components Group

UK . 1,170 parts In-Stock

1+ parts

$24.784

100+ parts

$23.545

1k+ parts

$22.306

10k+ parts

-

1,170

$24.784

$23.545

$22.306

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ChromeModa Solutions

Germany . 429 parts In-Stock

1+ parts

$24.784

100+ parts

$20.323

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429

$24.784

$20.323

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One Stop Electronics

USA . 1,217 parts In-Stock

1+ parts

$37.000

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1,217

$37.000

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Glotronic Ltd.

UK . 3,000 parts In-Stock

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3,000

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Corphita

USA . 2,761 parts In-Stock

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2,761

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Microchip USA

USA . 143 parts In-Stock

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143

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DigiPath Technology Company

USA . 83 parts In-Stock

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$22.345

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83

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$22.345

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Overview

Discover the innovative 74LVTH162373ZQLR by Texas Instruments, a high-quality Bus Driver & Transceiver perfect for various applications. With advanced technology and precision engineering, Texas Instruments delivers unmatched reliability and performance. This versatile product boasts fast propagation delays and low power consumption, making it an ideal choice for your design needs. Trust Texas Instruments to provide top-notch solutions that exceed expectations in every way. Experience the value and benefits of the 74LVTH162373ZQLR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resilient to impact.

Propagation Delay At Nominal Supply: 4.6 ns

Low propagation delay ensures quick transmission of signals, making the product efficient for high-speed data transfer.

Surface Mount: YES

Surface mount design allows for easy installation on PCBs, saving space and simplifying manufacturing processes.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage, making it compatible with standard power sources.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state output allows for high impedance when disabled, reducing load on the bus and preventing signal distortion.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures product reliability in extreme environmental conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for use in industrial settings without risk of overheating.

Technology: BICMOS

Utilizes advanced BiCMOS technology for improved performance and power efficiency.

Technical Specifications

Bus Driver & Transceivers 74LVTH162373ZQLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW/HIGH

Count Direction:

UNIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PBGA-B56

JESD-609 Code:

e1

Length:

7 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

4.6 ns

Propagation Delay (tpd):

5.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.5 mm

Trade Compliance

74LVTH162373ZQLR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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