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74LVCH16244ADGGRG4

Texas Instruments

74LVCH16244ADGGRG4 by Texas Instruments

BUS DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$0.733

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 854 parts In-Stock

1+ parts

-

100+ parts

$0.733

1k+ parts

$0.609

10k+ parts

$0.543

854

-

$0.733

$0.609

$0.543

DigiKey

USA . 854 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.690

10k+ parts

-

854

-

-

$0.690

-

Verical

USA . 854 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.761

10k+ parts

$0.678

854

-

-

$0.761

$0.678

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,454 parts In-Stock

1+ parts

$0.634

100+ parts

-

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-

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2,454

$0.634

-

-

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Vyrian

USA . 8,561 parts In-Stock

1+ parts

-

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-

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8,561

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,250 parts In-Stock

1+ parts

$0.600

100+ parts

-

1k+ parts

-

10k+ parts

-

3,250

$0.600

-

-

-

Andel Nordic

Denmark . 165 parts In-Stock

1+ parts

$7.786

100+ parts

-

1k+ parts

$7.474

10k+ parts

$7.474

165

$7.786

-

$7.474

$7.474

Parana Technologies

USA . 1,403 parts In-Stock

1+ parts

$11.522

100+ parts

-

1k+ parts

$11.934

10k+ parts

-

1,403

$11.522

-

$11.934

-

ChromeModa Solutions

Germany . 4,050 parts In-Stock

1+ parts

$12.946

100+ parts

$10.616

1k+ parts

-

10k+ parts

-

4,050

$12.946

$10.616

-

-

IDEA Electronic Components Group

UK . 1,639 parts In-Stock

1+ parts

$12.946

100+ parts

$12.299

1k+ parts

$11.651

10k+ parts

-

1,639

$12.946

$12.299

$11.651

-

Native Components

USA . 462 parts In-Stock

1+ parts

$1,900.430

100+ parts

$1,862.421

1k+ parts

$1,843.417

10k+ parts

$1,824.413

462

$1,900.430

$1,862.421

$1,843.417

$1,824.413

Northwest PG Solutions

USA . 952 parts In-Stock

1+ parts

$2,090.473

100+ parts

-

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952

$2,090.473

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Microchip USA

USA . 2,532 parts In-Stock

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2,532

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Perfect Parts

USA . 944 parts In-Stock

1+ parts

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944

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DigiPath Technology Company

USA . 224 parts In-Stock

1+ parts

-

100+ parts

$11.672

1k+ parts

-

10k+ parts

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224

-

$11.672

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-

Technical Specifications

Bus Driver & Transceivers 74LVCH16244ADGGRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.1 ns

Propagation Delay (tpd):

6.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74LVCH16244ADGGRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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