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74LVC1G3208DBVRG4

Texas Instruments

74LVC1G3208DBVRG4 by Texas Instruments

74LVC1G3208DBVRG4 by Texas Instruments is a CMOS Logic Gate with 3 inputs, 5.9 ns propagation delay, and 32 Amp max I (ol). It operates at a nominal voltage of 1.8V and is suitable for automotive applications due to its temperature grade. This small outline package has a low profile design and is ideal for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,991 parts In-Stock

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Vyrian

USA . 3,648 parts In-Stock

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Native Components

USA . 712 parts In-Stock

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$1.063

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712

$1.063

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Northwest PG Solutions

USA . 1,016 parts In-Stock

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$1.169

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AZTECH Wire

Italy . 281 parts In-Stock

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$5.861

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Parana Technologies

USA . 2,236 parts In-Stock

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$12.576

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$13.029

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DigiPath Technology Company

USA . 840 parts In-Stock

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$13.847

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$12.740

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840

$13.847

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ChromeModa Solutions

Germany . 5,392 parts In-Stock

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$14.130

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$11.587

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$14.130

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IDEA Electronic Components Group

UK . 821 parts In-Stock

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$14.130

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$13.424

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$12.717

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821

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One Stop Electronics

USA . 878 parts In-Stock

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$18.000

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Corphita

USA . 4,466 parts In-Stock

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Perfect Parts

USA . 3,956 parts In-Stock

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Microchip USA

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Overview

Unlock endless possibilities with the Texas Instruments 74LVC1G3208DBVRG4 logic gate. Designed with top-quality materials and advanced technology, this small yet powerful component offers fast propagation delay, low power consumption, and a wide operating temperature range, making it ideal for automotive applications. Say goodbye to limitations and hello to innovation with this versatile logic gate from a trusted manufacturer. Elevate your projects today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various electronic applications.

Propagation Delay At Nominal Supply: 5.9 ns

The low propagation delay ensures fast signal processing, making the product efficient for time-sensitive applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort in production.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage of 1.8V makes the product energy-efficient and suitable for low-power applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltage levels, making the product versatile and efficient.

Technical Specifications

Logic Gates 74LVC1G3208DBVRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

3

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.9 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

74LVC1G3208DBVRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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