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74LVC1G125DBVRG4

Texas Instruments

74LVC1G125DBVRG4 by Texas Instruments

74LVC1G125DBVRG4 by Texas Instruments is a CMOS bus driver with 3-STATE output, operating at temperatures from -40 to 125 °C. It has a propagation delay of 9 ns at Vsup of 3.3V, suitable for automotive applications due to its small outline and low profile package style.

Median Price

$1.420

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 1,903 parts In-Stock

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$1.420

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$0.272

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Avnet

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Digiode

USA . 660 parts In-Stock

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Vyrian

USA . 8,628 parts In-Stock

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Semi Source

USA . 6,280 parts In-Stock

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Sensible Micro Corp

USA . 1,409 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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Prism Electronics

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VNN

France . 90 parts In-Stock

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J2 Sourcing AB

Sweden . 35 parts In-Stock

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Speed Components Ltd

Israel . 10 parts In-Stock

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Corohmni

South Africa . 54 parts In-Stock

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$0.079

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Ampacity Inc.

Singapore . 246 parts In-Stock

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Corphita

USA . 3,536 parts In-Stock

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Semicontronic

India . 292 parts In-Stock

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Parana Technologies

USA . 1,667 parts In-Stock

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$8.621

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$9.290

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DigiPath Technology Company

USA . 1,816 parts In-Stock

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$9.493

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$8.734

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ChromeModa Solutions

Germany . 5,437 parts In-Stock

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$9.687

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$7.943

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IDEA Electronic Components Group

UK . 647 parts In-Stock

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$9.203

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$8.718

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AZTECH Wire

Italy . 264 parts In-Stock

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Advanced Electronics

New Zealand . 300 parts In-Stock

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$33.319

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Andel Nordic

Denmark . 599 parts In-Stock

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Continental Prestige Electronics

USA . 2,659 parts In-Stock

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Aranea Global

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Argo Parts USA

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A-Z Elektronik GmbH

Germany . 1,040 parts In-Stock

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Overview

Looking for top-notch quality in bus drivers and transceivers? Look no further than the 74LVC1G125DBVRG4 by Texas Instruments. With a reputation for excellence, Texas Instruments delivers products that exceed expectations. This small outline, low profile device is perfect for a wide range of applications, offering fast propagation delay, true output polarity, and a wide temperature range. Trust Texas Instruments to provide reliable solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, making the product suitable for various operating conditions.

Propagation Delay At Nominal Supply: 4.7 ns

Low propagation delay ensures fast signal transmission, enhancing the efficiency of the bus driver and transceiver.

Surface Mount: YES

SMD package allows for easy and convenient installation on circuit boards, saving space and facilitating automated manufacturing processes.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage, making it compatible with a wide range of applications and power sources.

Load Capacitance (CL): 50 pF

Designed to drive capacitive loads, ensuring signal integrity and reliable performance in high-speed communication systems.

Power Supplies (V): 3.3

Optimized for use with 3.3V power supplies, providing stable operation and efficient power consumption.

No. of Terminals: 5

Simplified connection with a limited number of terminals, reducing complexity and facilitating installation and maintenance.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact package design saves space on the PCB, allowing for high-density integration and optimized board layout.

Maximum I (ol): 32 Amp

High output current capability enables driving of heavy loads, making it suitable for demanding industrial applications.

Propagation Delay (tpd): 9 ns

Low propagation delay ensures rapid signal transmission, reducing latency and improving overall system performance.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows for reliable operation in harsh environments, such as automotive or industrial applications.

Output Characteristics: 3-STATE

3-state output allows for bus sharing and multi-drop connections, enhancing system flexibility and enabling efficient communication.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, making it suitable for outdoor applications or environments with temperature variations.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish ensures reliable electrical contact and resistance to corrosion, enhancing product longevity and performance.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options and compatibility with different PCB layouts, facilitating design flexibility.

No. of Ports: 2

Dual ports enable easy connection to multiple devices or circuits, enhancing signal distribution and improving system scalability.

Maximum Seated Height: 1.45 mm

Low-profile design saves space on the PCB and reduces overall system height, making it suitable for compact and portable applications.

Width: 1.6 mm

Compact width enables efficient use of space on the PCB, allowing for high-density integration and streamlined circuit design.

Output Polarity: TRUE

True output polarity ensures correct signal transmission and interpretation, reducing the risk of errors and improving system reliability.

Minimum Supply Voltage (Vsup): 1.65 V

Wide supply voltage range allows for compatibility with various power sources, ensuring versatile use in different applications.

Peak Reflow Temperature °C: 260

High peak reflow temperature withstands soldering processes, ensuring reliable assembly and solder joint integrity.

Length: 2.9 mm

Compact length saves space on the PCB and allows for efficient placement within the system, contributing to overall size reduction.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures reliable operation in automotive applications, meeting industry standards and regulations.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, enhancing the performance and efficiency of the product.

Terminal Form: GULL WING

Gull-wing terminal configuration facilitates easy surface mounting and enhances solder joint reliability, ensuring secure connections.

Packing Method: TR

Tape and reel packaging method enables automated assembly processes, simplifies handling, and protects components during shipping and storage.

Terminal Pitch: 0.95 mm

Narrow terminal pitch allows for high-density mounting on the PCB, maximizing board space utilization and enabling compact system design.

Count Direction: UNIDIRECTIONAL

Unidirectional count direction simplifies system design and operation, ensuring consistent and predictable signal transmission.

Control Type: ENABLE LOW

Enable low control type offers easy interfacing with external devices and allows for seamless integration into existing systems, enhancing usability.

Maximum Supply Voltage (Vsup): 5.5 V

Wide supply voltage range supports compatibility with various power sources, enhancing flexibility and versatility in different applications.

Maximum Power Supply Current (ICC): 0.01 mA

Low power supply current consumption contributes to energy efficiency, prolongs battery life, and reduces operating costs in power-sensitive applications.

Technical Specifications

Bus Driver & Transceivers 74LVC1G125DBVRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.7 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

74LVC1G125DBVRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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