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74FCT162827ATPACT

Texas Instruments

74FCT162827ATPACT by Texas Instruments

74FCT162827ATPACT by Texas Instruments is a Bus Driver & Transceiver with 10 bits, 5ns propagation delay, and 24A max I (ol). It is used in industrial applications for true output polarity control with a supply voltage range of 4.5V to 5.5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,767 parts In-Stock

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8,767

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Digiode

USA . 4,949 parts In-Stock

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4,949

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Distributors (Availability)

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Andel Nordic

Denmark . 492 parts In-Stock

1+ parts

$3.200

100+ parts

-

1k+ parts

$3.072

10k+ parts

$3.072

492

$3.200

-

$3.072

$3.072

AZTECH Wire

Italy . 402 parts In-Stock

1+ parts

$18.463

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402

$18.463

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Parana Technologies

USA . 1,585 parts In-Stock

1+ parts

$19.510

100+ parts

-

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$19.515

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1,585

$19.510

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$19.515

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DigiPath Technology Company

USA . 2,171 parts In-Stock

1+ parts

$21.483

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2,171

$21.483

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ChromeModa Solutions

Germany . 1,766 parts In-Stock

1+ parts

$21.921

100+ parts

$17.975

1k+ parts

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10k+ parts

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1,766

$21.921

$17.975

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IDEA Electronic Components Group

UK . 1,494 parts In-Stock

1+ parts

$21.921

100+ parts

$20.825

1k+ parts

$19.729

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-

1,494

$21.921

$20.825

$19.729

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One Stop Electronics

USA . 354 parts In-Stock

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$29.000

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354

$29.000

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Native Components

USA . 341 parts In-Stock

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$95.966

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$92.127

341

$95.966

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$92.127

Northwest PG Solutions

USA . 893 parts In-Stock

1+ parts

$105.562

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893

$105.562

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Glotronic Ltd.

UK . 3,000 parts In-Stock

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Corphita

USA . 1,665 parts In-Stock

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Microchip USA

USA . 488 parts In-Stock

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488

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Overview

Enhance your digital designs with the Texas Instruments 74FCT162827ATPACT, a premier Bus Driver & Transceiver offering unmatched quality and reliability. Manufactured by Texas Instruments, known for their cutting-edge technology and innovative solutions, this product boasts a wide range of applications in various industries. With fast propagation delay, low power consumption, and a compact design, this device ensures seamless data transmission while maximizing efficiency. Elevate your projects with the value and performance that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product light and durable, perfect for use in various applications without adding unnecessary weight.

Propagation Delay At Nominal Supply: 5 ns

With a low propagation delay, this bus driver & transceiver ensures fast and efficient data transmission, making it ideal for time-sensitive applications.

No. of Functions: 2

Having multiple functions in one device enables better integration and functionality in a compact form factor, reducing the need for additional components.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage, this product can be easily integrated into existing systems without the need for additional voltage converters.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this device can withstand extended use in harsh environments and industrial settings without overheating.

Technical Specifications

Bus Driver & Transceivers 74FCT162827ATPACT attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

FCT

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Load Capacitance (CL):

300 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

10

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.5 mA

Propagation Delay At Nominal Supply:

5 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74FCT162827ATPACT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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