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74CBT3305CDGKRG4

Texas Instruments

74CBT3305CDGKRG4 by Texas Instruments

74CBT3305CDGKRG4 by Texas Instruments is a Bus Driver & Transceiver with 2 functions, operating at a supply voltage of 5V. It features a propagation delay of 0.24ns and operates in industrial temperature range (-40 to 85 °C). Ideal for applications requiring high-speed data transmission in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,658 parts In-Stock

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Digiode

USA . 1,583 parts In-Stock

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1,583

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Distributors (Availability)

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Native Components

USA . 831 parts In-Stock

1+ parts

$0.055

100+ parts

-

1k+ parts

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$0.053

831

$0.055

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-

$0.053

AZTECH Wire

Italy . 799 parts In-Stock

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$5.846

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799

$5.846

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Andel Nordic

Denmark . 27 parts In-Stock

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$6.407

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-

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$6.151

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$6.151

27

$6.407

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$6.151

$6.151

Parana Technologies

USA . 1,586 parts In-Stock

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$19.558

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$19.560

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1,586

$19.558

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$19.560

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DigiPath Technology Company

USA . 1,638 parts In-Stock

1+ parts

$21.536

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1,638

$21.536

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ChromeModa Solutions

Germany . 1,495 parts In-Stock

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$21.975

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$18.020

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1,495

$21.975

$18.020

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IDEA Electronic Components Group

UK . 1,385 parts In-Stock

1+ parts

$21.975

100+ parts

$20.876

1k+ parts

$19.778

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1,385

$21.975

$20.876

$19.778

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One Stop Electronics

USA . 186 parts In-Stock

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$53.000

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186

$53.000

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Component Stockers USA

USA . 570 parts In-Stock

1+ parts

$99.990

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570

$99.990

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Corphita

USA . 3,067 parts In-Stock

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Northwest PG Solutions

USA . 1,751 parts In-Stock

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Microchip USA

USA . 393 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the 74CBT3305CDGKRG4 by Texas Instruments, a leading manufacturer in the industry of Bus Driver & Transceivers. This versatile device offers seamless functionality across a variety of applications, providing customers with exceptional value and performance. With its compact design and advanced technology, this product delivers fast propagation delay and precise output characteristics, making it an ideal choice for industrial settings. Upgrade your projects with the trusted brand and innovative features of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, making the product long-lasting and resistant to wear and tear.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and improving overall product stability.

No. of Functions: 2

Provides multiple functions in a single component, saving space and simplifying circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with a wide range of systems and applications.

Propagation Delay (tpd): 0.24 ns

Has a fast propagation delay, ensuring quick signal processing and data transmission.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature conditions, providing reliability and stability.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Bus Driver & Transceivers 74CBT3305CDGKRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay (tpd):

.24 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

74CBT3305CDGKRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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