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74CB3T16210DGGRG4

Texas Instruments

74CB3T16210DGGRG4 by Texas Instruments

74CB3T16210DGGRG4 by Texas Instruments is a Bus Driver & Transceiver with 2 functions, 10 bits, and 0.25 ns propagation delay. It operates at a nominal voltage of 2.5V and is ideal for industrial applications requiring bidirectional control with enable low feature.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,545 parts In-Stock

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5,545

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Digiode

USA . 2,470 parts In-Stock

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2,470

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 845 parts In-Stock

1+ parts

$0.218

100+ parts

-

1k+ parts

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$0.209

845

$0.218

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$0.209

Northwest PG Solutions

USA . 1,612 parts In-Stock

1+ parts

$0.240

100+ parts

-

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$0.211

1,612

$0.240

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$0.211

Andel Nordic

Denmark . 250 parts In-Stock

1+ parts

$5.486

100+ parts

-

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$5.267

10k+ parts

$5.267

250

$5.486

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$5.267

$5.267

AZTECH Wire

Italy . 231 parts In-Stock

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$6.513

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231

$6.513

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One Stop Electronics

USA . 259 parts In-Stock

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$17.000

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259

$17.000

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Parana Technologies

USA . 198 parts In-Stock

1+ parts

$28.400

100+ parts

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$47.019

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198

$28.400

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$47.019

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DigiPath Technology Company

USA . 2,108 parts In-Stock

1+ parts

$31.272

100+ parts

$28.770

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2,108

$31.272

$28.770

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ChromeModa Solutions

Germany . 5,567 parts In-Stock

1+ parts

$31.910

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$26.166

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5,567

$31.910

$26.166

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IDEA Electronic Components Group

UK . 1,412 parts In-Stock

1+ parts

$31.910

100+ parts

$30.314

1k+ parts

$28.719

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1,412

$31.910

$30.314

$28.719

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Microchip USA

USA . 2,161 parts In-Stock

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Kepictronics

USA . 543 parts In-Stock

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543

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Corphita

USA . 459 parts In-Stock

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459

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Overview

Enhance your electronic designs with the 74CB3T16210DGGRG4 by Texas Instruments, a top-tier manufacturer known for quality and innovation in the Bus Driver & Transceivers category. This versatile product offers high performance and reliability, making it perfect for a wide range of applications. With its advanced features and efficient design, this component provides exceptional value and benefits to customers looking for seamless integration and optimal functionality in their projects. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations and elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the components within the package, ensuring the reliability and longevity of the product.

Propagation Delay At Nominal Supply: 0.25 ns

Low propagation delay ensures fast and efficient data transmission, making the product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

No. of Functions: 2

Having multiple functions in a single package enhances the versatility and functionality of the product, making it a cost-effective solution.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a common supply voltage of 2.5V ensures compatibility with standard power sources, making integration into existing systems straightforward.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range allows the product to withstand harsh environmental conditions, making it suitable for a wide range of applications in industrial settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers 74CB3T16210DGGRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CB3T/3VT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

10

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74CB3T16210DGGRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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