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74CB3Q3306ADCURE4

Texas Instruments

74CB3Q3306ADCURE4 by Texas Instruments

74CB3Q3306ADCURE4 by Texas Instruments is a bus driver with 0.2 ns propagation delay, suitable for industrial applications. It operates at 2.5V nominal voltage and has 8 terminals in a small outline package style. With true output polarity and enable low control type, it offers bidirectional functionality with 3-state output characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,856 parts In-Stock

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6,856

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Digiode

USA . 2,269 parts In-Stock

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2,269

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Bristol Electronics

USA . 1,126 parts In-Stock

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Atlantic Semiconductor

USA . 358 parts In-Stock

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358

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Distributors (Availability)

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Native Components

USA . 214 parts In-Stock

1+ parts

$0.039

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-

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$0.037

214

$0.039

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$0.037

Parana Technologies

USA . 1,586 parts In-Stock

1+ parts

$16.702

100+ parts

$1,551.010

1k+ parts

$15.032

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1,586

$16.702

$1,551.010

$15.032

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DigiPath Technology Company

USA . 1,988 parts In-Stock

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$18.391

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1,988

$18.391

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ChromeModa Solutions

Germany . 3,323 parts In-Stock

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$18.766

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$15.388

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3,323

$18.766

$15.388

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IDEA Electronic Components Group

UK . 1,533 parts In-Stock

1+ parts

$18.766

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$17.828

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$16.889

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1,533

$18.766

$17.828

$16.889

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AZTECH Wire

Italy . 350 parts In-Stock

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$19.461

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350

$19.461

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One Stop Electronics

USA . 1,328 parts In-Stock

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$42.000

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1,328

$42.000

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Metaverse IC Inc.

Canada . 30,324 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,031 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,440 parts In-Stock

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Microchip USA

USA . 4,702 parts In-Stock

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Corphita

USA . 1,924 parts In-Stock

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Northwest PG Solutions

USA . 1,143 parts In-Stock

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1,143

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Overview

Enhance your electronic designs with the 74CB3Q3306ADCURE4 by Texas Instruments, a top-tier manufacturer known for quality and innovation. As a Bus Driver & Transceiver component, this product offers seamless signal transmission and reliable performance in various applications. With a compact design and low power consumption, this device ensures efficiency without compromising on functionality. Upgrade your projects with the trusted reliability and advanced technology of Texas Instruments, setting new standards in the industry. Unlock your potential with the 74CB3Q3306ADCURE4 and experience unparalleled value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 0.2 ns

Low propagation delay ensures quick signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

No. of Functions: 2

With 2 functions in one component, this product offers added functionality and versatility in circuit designs.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal voltage of 2.5V ensures compatibility with common voltage standards, making it easy to incorporate into existing systems.

No. of Terminals: 8

Having 8 terminals provides sufficient connection points for various inputs and outputs, enabling complex signal routing.

Minimum Operating Temperature: -40 °C

Wide temperature range from -40°C to 85°C makes this product suitable for operation in harsh environments and ensures reliability in extreme conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers 74CB3Q3306ADCURE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CB3Q/3VH/3C/2B

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

2 mA

Propagation Delay At Nominal Supply:

.2 ns

Propagation Delay (tpd):

.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Trade Compliance

74CB3Q3306ADCURE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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