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74CB3Q16244DGGRG4

Texas Instruments

74CB3Q16244DGGRG4 by Texas Instruments

74CB3Q16244DGGRG4 by Texas Instruments is a bus driver with 4 functions, 0.3 ns propagation delay, and operates at 2.5V. Ideal for industrial applications requiring bidirectional control with a temperature range of -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,596 parts In-Stock

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Vyrian

USA . 3,776 parts In-Stock

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3,776

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Distributors (Availability)

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Andel Nordic

Denmark . 173 parts In-Stock

1+ parts

$5.249

100+ parts

-

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$5.039

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$5.039

173

$5.249

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$5.039

$5.039

AZTECH Wire

Italy . 895 parts In-Stock

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$16.779

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895

$16.779

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Parana Technologies

USA . 1,482 parts In-Stock

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$18.428

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$18.549

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$18.428

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$18.549

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ChromeModa Solutions

Germany . 2,389 parts In-Stock

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$20.706

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$16.979

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2,389

$20.706

$16.979

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IDEA Electronic Components Group

UK . 2,159 parts In-Stock

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$20.706

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$19.671

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$18.635

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2,159

$20.706

$19.671

$18.635

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One Stop Electronics

USA . 1,612 parts In-Stock

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$27.000

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Corphita

USA . 3,608 parts In-Stock

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Northwest PG Solutions

USA . 1,838 parts In-Stock

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DigiPath Technology Company

USA . 1,735 parts In-Stock

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$18.669

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$18.669

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Microchip USA

USA . 1,627 parts In-Stock

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Native Components

USA . 12 parts In-Stock

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Overview

Experience high-quality and reliable performance with the 74CB3Q16244DGGRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge bus drivers & transceivers that are perfect for a wide range of applications. With its advanced technology and top-notch materials, this product offers customers unmatched value and benefits. Trust Texas Instruments to provide you with the solutions you need for your projects, ensuring efficiency and excellence every step of the way.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and helps protect the internal components of the bus driver & transceiver, ensuring longevity and reliability.

Propagation Delay At Nominal Supply: 0.3 ns

Low propagation delay of 0.3 ns ensures fast and efficient communication between devices, making this product ideal for high-speed data transmission applications.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB, making it convenient for compact designs and mass production.

No. of Functions: 4

Having 4 functions in one component simplifies the circuit design, reduces component count, and enhances overall system efficiency.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures that the product meets automotive-grade standards for reliability, making it suitable for automotive applications.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal supply voltage of 2.5V makes this bus driver & transceiver energy-efficient and compatible with various low-power applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand harsh environmental conditions, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of systems, making this product versatile and efficient.

Technical Specifications

Bus Driver & Transceivers 74CB3Q16244DGGRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CB3Q/3VH/3C/2B

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

2 mA

Propagation Delay At Nominal Supply:

.3 ns

Propagation Delay (tpd):

.3 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74CB3Q16244DGGRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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