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74ALVCH32973ZKER

Texas Instruments

74ALVCH32973ZKER by Texas Instruments

The Texas Instruments 74ALVCH32973ZKER is a bus driver with 8 bits, 3 ns propagation delay, and 24 Amp max I (ol). It is used for bidirectional control in industrial applications, featuring a low profile grid array package with surface mount capability.

Median Price

$6.320

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 444 parts In-Stock

1+ parts

$6.320

100+ parts

$4.660

1k+ parts

$3.340

10k+ parts

$3.260

444

$6.320

$4.660

$3.340

$3.260

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,569 parts In-Stock

1+ parts

$6.004

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-

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4,569

$6.004

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VNN

France . 14,663 parts In-Stock

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14,663

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Cyclops Electronics Ltd

UK . 1,362 parts In-Stock

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1,362

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Inventory MP

USA . 434 parts In-Stock

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434

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Vyrian

USA . 283 parts In-Stock

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283

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Bristol Electronics

USA . 165 parts In-Stock

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165

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Nova Conductors

Japan . 100 parts In-Stock

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100

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LWI Electronics Inc

India . 50 parts In-Stock

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50

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Connector Distribution Corp

USA . 45 parts In-Stock

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45

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Right Parts Inc.

USA . 41 parts In-Stock

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41

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Distributors (Availability)

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Andel Nordic

Denmark . 390 parts In-Stock

1+ parts

$2.578

100+ parts

-

1k+ parts

$2.475

10k+ parts

$2.475

390

$2.578

-

$2.475

$2.475

Ampacity Inc.

Singapore . 245 parts In-Stock

1+ parts

$5.370

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245

$5.370

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AZTECH Wire

Italy . 378 parts In-Stock

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$5.626

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378

$5.626

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Corphita

USA . 1,085 parts In-Stock

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$5.688

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1,085

$5.688

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Parana Technologies

USA . 22 parts In-Stock

1+ parts

$18.533

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$18.645

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22

$18.533

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$18.645

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DigiPath Technology Company

USA . 1,492 parts In-Stock

1+ parts

$20.408

100+ parts

$18.775

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1,492

$20.408

$18.775

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Corohmni

South Africa . 588 parts In-Stock

1+ parts

$20.551

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588

$20.551

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ChromeModa Solutions

Germany . 6,951 parts In-Stock

1+ parts

$20.824

100+ parts

$17.076

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6,951

$20.824

$17.076

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IDEA Electronic Components Group

UK . 1,036 parts In-Stock

1+ parts

$20.824

100+ parts

$19.783

1k+ parts

$18.742

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-

1,036

$20.824

$19.783

$18.742

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Kepictronics

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,985 parts In-Stock

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5,985

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Argo Parts USA

USA . 4,349 parts In-Stock

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Continental Prestige Electronics

USA . 4,005 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Microchip USA

USA . 175 parts In-Stock

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175

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unlock the power of efficient data transmission with the 74ALVCH32973ZKER by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality bus drivers and transceivers that ensure reliable performance in a variety of applications. With fast propagation delay and versatile functionality, this product offers unparalleled value and benefits to customers looking for seamless communication solutions. Upgrade your systems today with Texas Instruments and experience the difference in quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver & transceiver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 3 ns

This low propagation delay ensures fast signal processing, making this product suitable for high-speed communication applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort in the assembly process.

No. of Functions: 2

Having multiple functions in one component can simplify circuit design, reduce board space requirements, and potentially lower overall system costs.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage helps in minimizing power consumption, making this product energy-efficient.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliable performance in various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product suitable for battery-powered devices and noise-sensitive applications.

Technical Specifications

Bus Driver & Transceivers 74ALVCH32973ZKER attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

13.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.06 mA

Propagation Delay At Nominal Supply:

3 ns

Propagation Delay (tpd):

3.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

5.5 mm

Trade Compliance

74ALVCH32973ZKER Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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