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74ALVCH16244DGGRE4

Texas Instruments

74ALVCH16244DGGRE4 by Texas Instruments

74ALVCH16244DGGRE4 by Texas Instruments is a CMOS bus driver with 3.7 ns propagation delay, suitable for industrial applications. It operates at a supply voltage range of 1.65V to 3.6V and features a max I (ol) of 24Amp, making it ideal for driving signals in electronic systems requiring fast response times and low power consumption. With its small outline package style and dual terminal position, this device offers efficient signal transmission in compact designs while ensuring reliable performance under varying temperature conditions from -40°C to 85°C.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Vyrian

USA . 6,681 parts In-Stock

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Digiode

USA . 1,016 parts In-Stock

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Sea View Technologies

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Bristol Electronics

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Prism Electronics

USA . 5 parts In-Stock

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Native Components

USA . 298 parts In-Stock

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$1.075

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Northwest PG Solutions

USA . 2,190 parts In-Stock

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Andel Nordic

Denmark . 431 parts In-Stock

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$6.137

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$5.892

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$5.892

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Parana Technologies

USA . 1,587 parts In-Stock

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$8.200

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$8.810

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DigiPath Technology Company

USA . 1,814 parts In-Stock

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$9.030

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ChromeModa Solutions

Germany . 3,548 parts In-Stock

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IDEA Electronic Components Group

UK . 2,053 parts In-Stock

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One Stop Electronics

USA . 342 parts In-Stock

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AZTECH Wire

Italy . 444 parts In-Stock

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Corphita

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Speed Components Ltd (Excess)

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Microchip USA

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Perfect Parts

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Overview

Elevate your electronic designs with the Texas Instruments 74ALVCH16244DGGRE4 bus driver & transceiver. Crafted with precision and expertise, Texas Instruments delivers top-notch quality for optimal performance. This versatile component is perfect for a variety of applications, providing seamless communication between multiple devices. Experience the value of reliable operation, quick propagation delays, and efficient power consumption. Trust Texas Instruments to enhance your projects with cutting-edge technology and unmatched reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in buses and vehicles.

Propagation Delay At Nominal Supply: 3 ns

Fast propagation delay ensures quick response time, vital for real-time data transmission in bus driver applications.

Surface Mount: YES

Surface mount capability allows for easy installation and compact design, saving space in electronic equipment.

No. of Functions: 4

Multiple functions cater to various bus communication needs, enhancing the versatility of the product.

Nominal Supply Voltage / Vsup (V): 1.8

Operates efficiently at a low supply voltage of 1.8V, saving power and reducing energy consumption.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, enabling bus drivers to control data flow effectively and prevent data collisions.

Technical Specifications

Bus Driver & Transceivers 74ALVCH16244DGGRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

3 ns

Propagation Delay (tpd):

3.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74ALVCH16244DGGRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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