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74ALVCF162835DLG4

Texas Instruments

74ALVCF162835DLG4 by Texas Instruments

74ALVCF162835DLG4 by Texas Instruments is an 18-bit bus driver with a propagation delay of 3.5 ns at 2.5V, suitable for industrial applications. It features a small outline package style, operates at temperatures ranging from -40 to 85°C, and has a max supply voltage of 3.6V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,946 parts In-Stock

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Digiode

USA . 693 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 547 parts In-Stock

1+ parts

$2.981

100+ parts

-

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$2.862

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$2.862

547

$2.981

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$2.862

$2.862

Native Components

USA . 114 parts In-Stock

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$9.896

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114

$9.896

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Northwest PG Solutions

USA . 1,442 parts In-Stock

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$10.886

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$9.797

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$9.797

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AZTECH Wire

Italy . 293 parts In-Stock

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$13.697

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293

$13.697

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Parana Technologies

USA . 1,861 parts In-Stock

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$25.318

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$25.941

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1,861

$25.318

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$25.941

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DigiPath Technology Company

USA . 2,300 parts In-Stock

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$27.878

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$25.648

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2,300

$27.878

$25.648

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ChromeModa Solutions

Germany . 5,193 parts In-Stock

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$28.447

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$23.327

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IDEA Electronic Components Group

UK . 429 parts In-Stock

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$28.447

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$27.025

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$25.602

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429

$28.447

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$25.602

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One Stop Electronics

USA . 901 parts In-Stock

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$47.000

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901

$47.000

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Corphita

USA . 659 parts In-Stock

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Microchip USA

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Overview

Enhance the efficiency and reliability of your electronic designs with the Texas Instruments 74ALVCF162835DLG4 bus driver & transceiver. Crafted by a reputable manufacturer known for high-quality components, this product delivers seamless data transmission with minimal delay, making it ideal for applications requiring precision and speed. Offering a wide range of benefits including low power consumption and robust performance, this versatile device is a valuable addition to any project where dependable signal integrity is crucial. Trust in Texas Instruments to provide superior solutions for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes this product lightweight and durable, ideal for use in bus driver applications where reliability is key.

Propagation Delay At Nominal Supply: 3.5 ns

The low propagation delay of 3.5 ns ensures fast and efficient data transmission, making this product suitable for high-speed bus driver applications.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving on the PCB, making this product convenient for bus driver designs with limited space.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V is commonly used in bus driver circuits, ensuring compatibility and seamless integration with existing systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh environmental conditions commonly found in bus driver applications.

Technical Specifications

Bus Driver & Transceivers 74ALVCF162835DLG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

18 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

18

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.5 ns

Propagation Delay (tpd):

5.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.49 mm

Trade Compliance

74ALVCF162835DLG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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