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74AHC1G125DCKTG4

Texas Instruments

74AHC1G125DCKTG4 by Texas Instruments

74AHC1G125DCKTG4 by Texas Instruments is a CMOS bus driver with 3-STATE output, operating at temperatures from -40 to 125 °C. It has a propagation delay of 13 ns and can handle up to 8 Amps. Ideal for automotive applications due to its small size (2x1.25 mm) and low power consumption (0.01 mA).

Median Price

$0.840

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 149,856 parts In-Stock

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$0.840

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Digiode

USA . 4,754 parts In-Stock

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$0.798

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$0.798

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Vyrian

USA . 6,427 parts In-Stock

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Component Sense

UK . 1,085 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 403 parts In-Stock

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$0.756

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403

$0.756

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AZTECH Wire

Italy . 591 parts In-Stock

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$10.910

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591

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Parana Technologies

USA . 974 parts In-Stock

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$16.973

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$17.198

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974

$16.973

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$17.198

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DigiPath Technology Company

USA . 2,257 parts In-Stock

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$18.690

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$17.194

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IDEA Electronic Components Group

UK . 2,237 parts In-Stock

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$19.071

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$18.117

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$17.164

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2,237

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$17.164

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ChromeModa Solutions

Germany . 624 parts In-Stock

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$19.071

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$15.638

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624

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Component Stockers USA

USA . 181,146 parts In-Stock

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Robosynatics

Brazil . 5,000 parts In-Stock

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Lucentia Tech

USA . 5,000 parts In-Stock

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$32.812

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$30.384

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$30.384

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$30.384

$30.384

Northwest PG Solutions

USA . 1,220 parts In-Stock

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Microchip USA

USA . 1,201 parts In-Stock

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Native Components

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Overview

Elevate your electronic designs with the 74AHC1G125DCKTG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This bus driver & transceiver is perfect for a wide range of applications, offering unmatched performance and efficiency. With a small outline and thin profile package style, this product provides ease of use and integration into your projects. Experience the benefits of fast propagation delay, low power consumption, and high output current capability. Trust Texas Instruments to deliver exceptional value and innovation with the 74AHC1G125DCKTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in automotive applications where weight and durability are important factors.

Propagation Delay At Nominal Supply: 14 ns

A low propagation delay ensures efficient and fast signal transmission, making this product suitable for high-speed data transfer in bus driver applications.

Surface Mount: YES

Being surface mountable simplifies the installation process, allowing for easy and compact layout designs in electronic circuits.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage ensures compatibility with standard circuitry and power sources, making integration easier in existing systems.

Power Supplies (V): 2/5.5

The wide range of power supply voltage support (2V to 5.5V) provides flexibility in operating conditions and compatibility with various power sources.

No. of Terminals: 5

Having 5 terminals allows for multiple connectivity options, enhancing versatility and functionality in circuit connections.

Maximum I (ol): 8 Amp

The high output current capability of 8A enables driving of heavy loads, making this product suitable for applications requiring robust and reliable performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh environmental conditions typically found in automotive and industrial settings.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of digital and analog signals, making it a versatile and efficient choice.

Technical Specifications

Bus Driver & Transceivers 74AHC1G125DCKTG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

74AHC1G125DCKTG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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