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74ACT11240DBRE4

Texas Instruments

74ACT11240DBRE4 by Texas Instruments

74ACT11240DBRE4 by Texas Instruments is a bus driver with 10.6 ns propagation delay, suitable for industrial applications. It features 2 functions, operates at 5V, and has a load capacitance of 50 pF. This CMOS technology device comes in a small outline package with dual terminals and inverted output polarity.

Median Price

-

Lifecycle Status

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2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,235 parts In-Stock

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Digiode

USA . 4,745 parts In-Stock

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4,745

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Distributors (Availability)

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Native Components

USA . 120 parts In-Stock

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$0.247

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$0.237

120

$0.247

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$0.237

Northwest PG Solutions

USA . 1,785 parts In-Stock

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$0.272

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-

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$0.240

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$0.272

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$0.240

Parana Technologies

USA . 1,756 parts In-Stock

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$7.610

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$8.125

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$7.610

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$8.125

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Andel Nordic

Denmark . 317 parts In-Stock

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$8.378

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$8.043

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$8.043

317

$8.378

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$8.043

$8.043

DigiPath Technology Company

USA . 29 parts In-Stock

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$8.380

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$7.710

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29

$8.380

$7.710

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ChromeModa Solutions

Germany . 4,650 parts In-Stock

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$8.551

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$7.012

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$8.551

$7.012

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IDEA Electronic Components Group

UK . 1,561 parts In-Stock

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$8.551

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$8.123

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$7.696

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AZTECH Wire

Italy . 848 parts In-Stock

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$16.552

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One Stop Electronics

USA . 1,260 parts In-Stock

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$36.000

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Corphita

USA . 3,845 parts In-Stock

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Microchip USA

USA . 267 parts In-Stock

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Overview

Enhance your electronic projects with the 74ACT11240DBRE4 by Texas Instruments, a top-tier manufacturer known for high-quality products. This bus driver & transceiver offers reliable performance and efficiency, making it perfect for a wide range of applications. With its advanced technology and innovative design, this component provides customers with exceptional value, benefits, and advantages. Upgrade your circuits today with the 74ACT11240DBRE4 and experience the difference that superior quality can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 10.6 ns

Low propagation delay ensures fast signal transmission and efficient operation of the bus driver and transceiver.

Surface Mount: YES

Surface mount design makes it easy to integrate this product onto circuit boards, saving space and simplifying assembly.

No. of Functions: 2

Having multiple functions allows for versatility in applications and increased functionality in the product.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of systems and power sources.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable performance and prevents signal distortion in the circuit.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows for reliable operation in various environments and conditions.

Output Characteristics: 3-STATE

3-state output allows for tristate control, enabling high impedance state for bus sharing applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications.

Technical Specifications

Bus Driver & Transceivers 74ACT11240DBRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

ACT

JESD-30 Code:

R-PDSO-G24

Length:

8.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10.6 ns

Propagation Delay (tpd):

10.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

74ACT11240DBRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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