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74ACT11004PWRG4

Texas Instruments

74ACT11004PWRG4 by Texas Instruments

74ACT11004PWRG4 by Texas Instruments is a logic gate with 6 functions, 9.7 ns propagation delay at 5V, and 50 pF load capacitance. It is used in industrial applications due to its CMOS technology, -40 to 85 °C operating temperature range, and small outline package style.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,149 parts In-Stock

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Digiode

USA . 4,780 parts In-Stock

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4,780

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One Stop Electronics

USA . 1,060 parts In-Stock

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$16.000

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$16.000

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AZTECH Wire

Italy . 346 parts In-Stock

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$16.113

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Parana Technologies

USA . 693 parts In-Stock

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$28.636

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$49.829

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DigiPath Technology Company

USA . 2,041 parts In-Stock

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$31.532

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ChromeModa Solutions

Germany . 3,496 parts In-Stock

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$32.175

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$26.384

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IDEA Electronic Components Group

UK . 567 parts In-Stock

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$32.175

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$30.566

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$28.958

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Native Components

USA . 185 parts In-Stock

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$42.515

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$40.814

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Northwest PG Solutions

USA . 1,531 parts In-Stock

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$46.766

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QUARKTWIN TECHNOLOGY LTD

USA . 6,233 parts In-Stock

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Corphita

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Microchip USA

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Overview

Elevate your logic gate game with the Texas Instruments 74ACT11004PWRG4. Manufactured by a trusted industry leader, this product offers high-quality performance and reliability. Ideal for a wide range of applications, this logic gate boasts a fast propagation delay of 9.7 ns, making it perfect for time-critical operations. With six functions packed into a small outline package, you'll enjoy the benefits of space-saving design without compromising on functionality. Upgrade to the 74ACT11004PWRG4 today and experience the value it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Propagation Delay At Nominal Supply: 9.7 ns

Low propagation delay ensures fast signal processing and efficient operation.

Surface Mount: YES

Surface mount capability makes installation and integration easier and more convenient.

No. of Functions: 6

Having multiple functions in one component increases the efficiency and reduces overall system complexity.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with a wide range of systems.

Load Capacitance (CL): 50 pF

Suitable load capacitance for efficient performance and signal transmission.

Power Supplies (V): 5

Consistent power supply at 5V ensures stable operation and performance.

No. of Terminals: 20

Sufficient number of terminals for connectivity and integration with other components.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Logic Gates 74ACT11004PWRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9.7 ns

Propagation Delay (tpd):

9.7 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

74ACT11004PWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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