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74AC11245NSR

Texas Instruments

74AC11245NSR by Texas Instruments

74AC11245NSR by Texas Instruments is an 8-bit bus driver with a propagation delay of 9.5 ns at 5V, suitable for industrial applications. It features a small outline package style, operates b/w -40 to 85°C, and supports common control with dual terminal position. The device has a max supply voltage of 5.5V and offers bidirectional communication with true output polarity in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,507 parts In-Stock

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Vyrian

USA . 2,355 parts In-Stock

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Electronics Depot

USA . 44 parts In-Stock

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44

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Distributors (Availability)

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Andel Nordic

Denmark . 81 parts In-Stock

1+ parts

$5.435

100+ parts

-

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$5.217

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$5.217

81

$5.435

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$5.217

$5.217

AZTECH Wire

Italy . 289 parts In-Stock

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$6.440

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289

$6.440

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Parana Technologies

USA . 113 parts In-Stock

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$22.376

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$23.051

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113

$22.376

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$23.051

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DigiPath Technology Company

USA . 1,079 parts In-Stock

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$24.639

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$22.668

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1,079

$24.639

$22.668

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ChromeModa Solutions

Germany . 5,844 parts In-Stock

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$25.142

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$20.616

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$25.142

$20.616

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IDEA Electronic Components Group

UK . 1,484 parts In-Stock

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$25.142

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$23.885

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$22.628

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1,484

$25.142

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$22.628

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One Stop Electronics

USA . 1,426 parts In-Stock

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$28.000

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Corphita

USA . 3,478 parts In-Stock

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Northwest PG Solutions

USA . 1,857 parts In-Stock

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Microchip USA

USA . 469 parts In-Stock

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Native Components

USA . 446 parts In-Stock

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Overview

Elevate your electronic projects with the Texas Instruments 74AC11245NSR bus driver & transceiver. With a reputation for top-quality manufacturing, Texas Instruments delivers reliable components for a wide range of applications. This versatile product offers customers value and benefits with its fast propagation delay, low power consumption, and 3-state output characteristics. Whether you're working on industrial machinery or consumer electronics, this small outline package design ensures easy integration and efficient performance. Upgrade your designs with the Texas Instruments 74AC11245NSR and experience the difference in quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and protection for the internal components of the bus driver/transceiver.

Propagation Delay At Nominal Supply: 9.5 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with a wide range of systems.

No. of Terminals: 24

Ample number of terminals allow for versatile connectivity options and compatibility with various setups.

Maximum I (ol): 24 Amp

High output current capability enables driving of power-hungry components without external amplification.

Output Characteristics: 3-STATE

3-state output allows for tristate control, enabling bus driver to be disconnected from the bus when not in use.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliable performance even in harsh environments or extreme conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various logic levels.

Terminal Form: GULL WING

Gull wing terminals provide secure solder joints and easy PCB mounting, enhancing overall reliability.

Technical Specifications

Bus Driver & Transceivers 74AC11245NSR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-PDSO-G24

Length:

15 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

5.3 mm

Trade Compliance

74AC11245NSR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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