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74AC11240DWRE4

Texas Instruments

74AC11240DWRE4 by Texas Instruments

74AC11240DWRE4 by Texas Instruments is a Bus Driver & Transceiver with 8.4ns Propagation Delay, 24 Amp Max I (ol), and -40 to 85°C Operating Temperature. It is used in industrial applications for driving buses and transceiving signals efficiently.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,674 parts In-Stock

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Digiode

USA . 3,786 parts In-Stock

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One Stop Electronics

USA . 167 parts In-Stock

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$15.000

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167

$15.000

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AZTECH Wire

Italy . 256 parts In-Stock

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$15.091

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$15.091

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Parana Technologies

USA . 1,422 parts In-Stock

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$26.573

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$27.141

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$26.573

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DigiPath Technology Company

USA . 759 parts In-Stock

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$29.260

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759

$29.260

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ChromeModa Solutions

Germany . 2,972 parts In-Stock

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$29.857

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$24.483

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2,972

$29.857

$24.483

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IDEA Electronic Components Group

UK . 1,537 parts In-Stock

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$29.857

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$28.364

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$26.871

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1,537

$29.857

$28.364

$26.871

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Andel Nordic

Denmark . 497 parts In-Stock

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$82.047

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$78.765

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$78.765

497

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$78.765

Corphita

USA . 4,537 parts In-Stock

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Northwest PG Solutions

USA . 874 parts In-Stock

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Native Components

USA . 520 parts In-Stock

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Microchip USA

USA . 351 parts In-Stock

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Robosynatics

Brazil . 30 parts In-Stock

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$15.211

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$14.085

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$14.085

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$14.085

Lucentia Tech

USA . 30 parts In-Stock

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$15.211

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$14.085

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$14.085

30

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$15.211

$14.085

$14.085

Overview

Enhance your electronic projects with the Texas Instruments 74AC11240DWRE4 Bus Driver & Transceiver. With a reputation for top-quality manufacturing, Texas Instruments delivers reliable components for a variety of applications. This product boasts fast propagation delay and 3-STATE output characteristics, making it ideal for high-speed data transmission. Enjoy the benefits of a small outline package, low power consumption, and versatile compatibility with both 3.3V and 5V power supplies. Upgrade your designs with the 74AC11240DWRE4 and experience seamless performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 8.4 ns

Fast propagation delay helps in quick signal transmission and efficient communication within the bus system.

Surface Mount: YES

Easy mounting on circuit boards, saving time and effort during installation.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard voltage requirements, making it easy to integrate into existing systems.

Output Characteristics: 3-STATE

Allows for flexible control over the output signal, enhancing the versatility of the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers 74AC11240DWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

AC

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

8.4 ns

Propagation Delay (tpd):

7.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

74AC11240DWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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