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74AC11109DR

Texas Instruments

74AC11109DR by Texas Instruments

74AC11109DR by Texas Instruments is a dual-function latches & flip-flops IC with 2 bits, operating at 3.3/5V. It features a propagation delay of 8.1ns, max frequency of 100MHz, and can handle load capacitance up to 50pF. Ideal for industrial applications requiring positive edge triggering in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,965 parts In-Stock

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5,965

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Digiode

USA . 2,150 parts In-Stock

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2,150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 649 parts In-Stock

1+ parts

$8.750

100+ parts

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649

$8.750

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Northwest PG Solutions

USA . 252 parts In-Stock

1+ parts

$9.625

100+ parts

$8.662

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252

$9.625

$8.662

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Parana Technologies

USA . 1,512 parts In-Stock

1+ parts

$17.896

100+ parts

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$18.066

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1,512

$17.896

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$18.066

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AZTECH Wire

Italy . 417 parts In-Stock

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$19.019

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417

$19.019

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DigiPath Technology Company

USA . 156 parts In-Stock

1+ parts

$19.706

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156

$19.706

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ChromeModa Solutions

Germany . 1,907 parts In-Stock

1+ parts

$20.108

100+ parts

$16.489

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1,907

$20.108

$16.489

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IDEA Electronic Components Group

UK . 1,884 parts In-Stock

1+ parts

$20.108

100+ parts

$19.103

1k+ parts

$18.097

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1,884

$20.108

$19.103

$18.097

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One Stop Electronics

USA . 1,437 parts In-Stock

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$48.000

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1,437

$48.000

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Corphita

USA . 1,628 parts In-Stock

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1,628

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Overview

Unlock a world of possibilities with the Texas Instruments 74AC11109DR, a high-quality latch & flip-flop device designed to meet your circuit needs. Manufactured by industry leader Texas Instruments, this versatile product offers superior performance and reliability for a wide range of applications. With a compact design and advanced technology, this component ensures seamless operation and precise results. Experience the value and benefits of Texas Instruments' 74AC11109DR - the perfect choice for your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protects the internal components of the latch/flip-flop.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into circuit boards.

No. of Functions: 2

Having 2 functions provides versatility and flexibility in circuit design and operation.

Package Shape: RECTANGULAR

Rectangular package shape allows for space-efficient placement on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Supports a standard nominal supply voltage of 5V, making it compatible with many existing systems.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance ensures efficient performance and signal integrity.

Power Supplies (V): 3.3/5

Supports a range of power supplies including 3.3V and 5V, increasing compatibility with different systems.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and enhanced functionality.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and is suitable for compact electronic devices.

Maximum I (ol): 24 Amp

High maximum output current of 24 Amp supports heavy-duty applications.

Propagation Delay (tpd): 8.1 ns

Fast propagation delay of 8.1 ns ensures quick response and signal processing.

Maximum Operating Temperature: 85 °C

Operates effectively within a wide temperature range, suitable for industrial environments.

Trigger Type: POSITIVE EDGE

Positive edge trigger type offers precise control and synchronization of operations.

Minimum Operating Temperature: -40 °C

Operates reliably even in extremely low temperatures, ensuring consistent performance.

Terminal Position: DUAL

Dual terminal position allows for easy connectivity and secure connections.

Maximum Seated Height: 1.75 mm

Low maximum seated height facilitates compact and slim device designs.

Width: 3.9 mm

Compact width of 3.9 mm fits well within limited spaces on circuit boards.

Output Polarity: COMPLEMENTARY

Complementary output polarity enhances signal integrity and reduces noise interference.

Minimum Supply Voltage (Vsup): 3 V

Supports a minimum supply voltage of 3V, ensuring compatibility with a variety of systems.

Length: 9.9 mm

Optimal length of 9.9 mm for efficient placement and integration in electronic assemblies.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions.

Maximum Frequency At Nominal Supply: 100000000 Hz

High maximum frequency at nominal supply enables rapid data processing and high-speed operations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections and ease of installation.

Packing Method: TR

TR packing method ensures safe transportation and handling of the product.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch enables precise connections and compact layout designs.

Minimum fmax: 100 MHz

Minimum fmax of 100 MHz indicates high-speed performance and efficient data processing capabilities.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a maximum supply voltage of 5.5V, providing a safety margin for voltage fluctuations.

Technical Specifications

Latches & Flip-Flops 74AC11109DR attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

100000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Propagation Delay (tpd):

8.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

100 MHz

Trade Compliance

74AC11109DR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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