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74AC11074DBLE

Texas Instruments

74AC11074DBLE by Texas Instruments

74AC11074DBLE by Texas Instruments is a CMOS latch with 2 functions, operating at temperatures from -40 to 85 °C. It has a load capacitance of 50 pF and can handle up to 24 Amps. This small outline flip-flop is ideal for industrial applications requiring positive edge triggering and dual terminal positions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,023 parts In-Stock

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Digiode

USA . 4,823 parts In-Stock

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Native Components

USA . 424 parts In-Stock

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$0.185

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$0.178

424

$0.185

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$0.178

Northwest PG Solutions

USA . 622 parts In-Stock

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$0.203

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$0.179

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$0.203

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$0.179

AZTECH Wire

Italy . 860 parts In-Stock

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$10.487

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$10.487

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Parana Technologies

USA . 921 parts In-Stock

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$14.918

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$15.344

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921

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DigiPath Technology Company

USA . 51 parts In-Stock

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$16.427

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51

$16.427

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ChromeModa Solutions

Germany . 6,452 parts In-Stock

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$16.762

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$13.745

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IDEA Electronic Components Group

UK . 2,371 parts In-Stock

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$16.762

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$15.924

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$15.086

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One Stop Electronics

USA . 751 parts In-Stock

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$53.000

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Corphita

USA . 4,510 parts In-Stock

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Overview

Elevate your electronic designs with the high-quality 74AC11074DBLE latch and flip-flop by Texas Instruments. Known for their reliability and innovation, Texas Instruments delivers top-notch products like this one, ideal for various applications in the latches and flip-flops category. With a small outline and shrink pitch package style, this versatile component offers customers exceptional value and benefits, ensuring seamless operation and performance. Upgrade your projects with the Texas Instruments 74AC11074DBLE for unparalleled quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the latch and flip-flop lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable, the latch and flip-flop can be easily integrated onto PCBs, saving space and simplifying assembly.

No. of Functions: 2

With two functions in one device, this latch and flip-flop offers versatility and efficiency in circuit design.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and alignment on the circuit board, ensuring proper connection and functionality.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF ensures fast and efficient operation of the latch and flip-flop in various circuits.

Power Supplies (V): 3.3/5

Compatible with both 3.3V and 5V power supplies, this latch and flip-flop can be used in a wide range of electronic devices.

No. of Terminals: 14

With 14 terminals, this latch and flip-flop provides sufficient connectivity options for connecting to other components in the circuit.

Maximum I (ol): 24 Amp

The high maximum output current of 24 Amp ensures that the latch and flip-flop can drive heavy loads effectively.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this latch and flip-flop can withstand high temperatures in industrial environments.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise and reliable switching between states in the latch and flip-flop.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this latch and flip-flop can operate effectively in cold environments.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage of 3V allows the latch and flip-flop to operate efficiently even in low-power applications.

Maximum Frequency At Nominal Supply: 100000000 Hz

With a maximum frequency of 100,000,000 Hz at nominal supply voltage, this latch and flip-flop can handle high-speed signal processing.

Technology: CMOS

Utilizing CMOS technology, this latch and flip-flop offers low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

The gull wing terminal form allows for easy and secure soldering onto the PCB, ensuring a strong and reliable connection.

Packing Method: TR

The TR packing method protects the latch and flip-flop during transportation and storage, preventing damage and ensuring product integrity.

Terminal Pitch: 0.635 mm

With a terminal pitch of 0.635mm, this latch and flip-flop can be easily mounted on standard PCBs, facilitating integration into various electronic systems.

Technical Specifications

Latches & Flip-Flops 74AC11074DBLE attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G14

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

100000000 Hz

Maximum I (ol):

24 Amp

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Trade Compliance

74AC11074DBLE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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