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5961-01-325-4713

Texas Instruments

5961-01-325-4713 by Texas Instruments

The Texas Instruments 5961-01-325-4713 is a TRIAC with max. DC gate trigger current of 15mA, max. leakage current of 2mA, and max. operating temp of 110°C. It is used as a trigger device in applications requiring a max RMS on-state current of 8A and repetitive peak off-state voltage of 600V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,652 parts In-Stock

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4,652

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Digiode

USA . 2,016 parts In-Stock

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2,016

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Distributors (Availability)

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Parana Technologies

USA . 111 parts In-Stock

1+ parts

$2.185

100+ parts

-

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$2.696

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111

$2.185

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$2.696

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DigiPath Technology Company

USA . 2,046 parts In-Stock

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$2.406

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2,046

$2.406

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ChromeModa Solutions

Germany . 6,439 parts In-Stock

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$2.455

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$2.013

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6,439

$2.455

$2.013

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IDEA Electronic Components Group

UK . 606 parts In-Stock

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$2.455

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$2.210

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606

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$2.210

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Northwest PG Solutions

USA . 2,266 parts In-Stock

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$2.598

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2,266

$2.598

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Semicontronic

India . 1,588 parts In-Stock

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$9.100

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$8.872

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$8.827

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1,588

$9.100

$8.872

$8.827

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One Stop Electronics

USA . 999 parts In-Stock

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$11.100

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$11.100

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AZTECH Wire

Italy . 341 parts In-Stock

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$18.300

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341

$18.300

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Ampacity Inc.

Singapore . 356 parts In-Stock

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$24.100

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356

$24.100

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Corphita

USA . 2,637 parts In-Stock

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2,637

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Native Components

USA . 1,000 parts In-Stock

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$2.291

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1,000

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$2.291

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Corohmni

South Africa . 239 parts In-Stock

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Overview

Experience the superior quality and reliability of the 5961-01-325-4713 by Texas Instruments, a leading manufacturer in the industry. This TRIAC device offers unmatched performance and precision, making it ideal for a wide range of applications. From lighting control to motor speed regulation, this product provides exceptional value and efficiency. Trust Texas Instruments to deliver innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the 5961-01-325-4713 and experience the difference today.

Feature Benefit Bullets

Maximum DC Gate Trigger Current: 15 mA

Allows for reliable triggering of the TRIAC, ensuring proper functioning.

Maximum Leakage Current: 2 mA

Low leakage current helps in reducing power wastage and improving efficiency.

Maximum Operating Temperature: 110 °C

Wide operating temperature range makes this TRIAC suitable for various industrial applications.

Trigger Device Type: TRIAC

Being a TRIAC allows for bidirectional conduction, making it versatile for AC switching applications.

Minimum Operating Temperature: -40 °C

Ensures reliable operation even in extreme cold conditions.

Maximum RMS On-state Current: 8 A

Capable of handling moderate to high current loads, suitable for a wide range of applications.

Maximum DC Gate Trigger Voltage: 3 V

Low trigger voltage ensures efficient triggering of the TRIAC.

Repetitive Peak Off-state Voltage: 600 V

Can withstand high voltage spikes, making it reliable in high voltage applications.

Minimum Critical Rate of Rise of Commutation Voltage: 5 V/us

Fast commutation voltage response ensures quick and effective switching.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/us

Fast response to off-state voltage changes ensures reliable turn-off of the TRIAC.

Maximum Holding Current: 30 mA

Higher holding current ensures the TRIAC remains in the conducting state, reducing the risk of accidental turn-off.

Technical Specifications

Triode For Alternating Current (TRIAC) 5961-01-325-4713 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Texas Instruments

Specs

Minimum Critical Rate of Rise of Commutation Voltage:

5 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

15 mA

Maximum DC Gate Trigger Voltage:

3 V

Maximum Holding Current:

30 mA

Maximum Leakage Current:

2 mA

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum RMS On-state Current:

8 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

5961-01-325-4713 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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