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XL0840-TR

STMicroelectronics

XL0840-TR by STMicroelectronics

XL0840-TR by STMicroelectronics is a single SCR in a cylindrical package, ideal for controlling high voltage applications. It features a max repetitive peak off-state voltage of 400 V, non-repetitive peak on-state current of 8 A, and operates b/w -40 °C to 125 °C. This device is perfect for power management in various electronic circuits.

Median Price

$0.066

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 121,000 parts In-Stock

1+ parts

-

100+ parts

$0.068

1k+ parts

$0.057

10k+ parts

$0.051

121,000

-

$0.068

$0.057

$0.051

Verical

USA . 121,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.063

121,000

-

-

-

$0.063

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,623 parts In-Stock

1+ parts

$0.053

100+ parts

-

1k+ parts

-

10k+ parts

-

1,623

$0.053

-

-

-

Vyrian

USA . 2,446 parts In-Stock

1+ parts

$0.056

100+ parts

-

1k+ parts

-

10k+ parts

-

2,446

$0.056

-

-

-

Anansix

USA . 1,857 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,857

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,528 parts In-Stock

1+ parts

$0.050

100+ parts

-

1k+ parts

-

10k+ parts

-

3,528

$0.050

-

-

-

IDEA Electronic Components Group

UK . 479 parts In-Stock

1+ parts

$2.533

100+ parts

-

1k+ parts

$2.279

10k+ parts

-

479

$2.533

-

$2.279

-

MKK Technologies

India . 228 parts In-Stock

1+ parts

$4.763

100+ parts

-

1k+ parts

-

10k+ parts

-

228

$4.763

-

-

-

DigiPath Technology Company

USA . 228 parts In-Stock

1+ parts

$4.763

100+ parts

-

1k+ parts

-

10k+ parts

-

228

$4.763

-

-

-

Parana Technologies

USA . 1,701 parts In-Stock

1+ parts

-

100+ parts

$3.028

1k+ parts

-

10k+ parts

-

1,701

-

$3.028

-

-

Overview

Elevate your projects with the XL0840-TR from STMicroelectronics, a trusted leader in semiconductor technology. This high-quality silicon controlled rectifier (SCR) is designed for exceptional performance in diverse applications, from power management to motor control. With its robust design and reliable operation even in extreme conditions, the XL0840-TR ensures durability and efficiency, giving you peace of mind that your systems will run smoothly and effectively. Experience innovation and reliability wrapped in one outstanding component!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity in various applications.

Maximum DC Gate Trigger Current: 0.2 mA

Low gate trigger current requirement contributes to energy efficiency and makes it easy to control.

Configuration: SINGLE

Single configuration simplifies integration into various circuits, making it suitable for compact designs.

Non Repetitive Peak On-state Current: 8 A

High non-repetitive peak on-state current allows for versatility in handling temporary overload conditions.

Package Shape: ROUND

The round package shape aids in efficient heat dissipation, enhancing product performance.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures stable connections and is ideal for robust PCB designs.

Maximum On-state Current: 0.5 A

This specification enables the SCR to control considerable current effectively while ensuring safe operation.

Maximum Repetitive Peak Off-state Leakage Current: 0.1 uA

Extremely low leakage current minimizes energy loss and enhances performance in sensitive applications.

No. of Terminals: 3

Three terminals facilitate easy connections and versatile configurations, providing design flexibility.

Package Style (Meter): CYLINDRICAL

Cylindrical package style is effective for heat management and is widely compatible with various mounting techniques.

Maximum Operating Temperature: 125 °C

This high operating temperature rating allows the SCR to function reliably in harsh environments.

Trigger Device Type: SCR

As a silicon controlled rectifier, it offers precise control of power flow, making it ideal for switching applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature expands application range, particularly in cold environments.

Terminal Position: BOTTOM

Bottom terminal positioning is advantageous for layout design and optimal space utilization on PCBs.

Maximum RMS On-state Current: 0.8 A

A higher RMS on-state current supports robust performance in a wider range of applications.

Maximum DC Gate Trigger Voltage: 0.8 V

Low gate trigger voltage allows for integration with low-voltage control circuits, enhancing usability.

Repetitive Peak Off-state Voltage: 400 V

High repetitive peak off-state voltage ensures effective operation in high-voltage applications, making it versatile.

Minimum Critical Rate of Rise of Off-state Voltage: 75 V/us

This capability offers quick turn-off characteristics, enhancing the overall efficiency of power management.

Maximum Holding Current: 5 mA

This low holding current requirement enhances the reliability of the device in maintaining circuit stability.

Technical Specifications

Silicon Controlled Rectifiers (SCR) XL0840-TR attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from STMicroelectronics

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

75 V/us

Maximum DC Gate Trigger Current:

.2 mA

Maximum DC Gate Trigger Voltage:

.8 V

Maximum Holding Current:

5 mA

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

Non Repetitive Peak On-state Current:

8 A

No. of Elements:

1

No. of Terminals:

3

Maximum On-state Current:

.5 A

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum RMS On-state Current:

.8 A

Maximum Repetitive Peak Off-state Leakage Current:

.1 uA

Repetitive Peak Off-state Voltage:

400 V

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

SCR

Trade Compliance

XL0840-TR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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