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VNQ830P-E

STMicroelectronics

VNQ830P-E by STMicroelectronics

VNQ830P-E by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V, supporting up to 4 functions. It features built-in protections against overcurrent and thermal issues, making it ideal for robust applications. With a compact SO package and 9A output peak current, it's perfect for efficient power management in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,471 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

4,471

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-

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Digiode

USA . 4,077 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,077

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-

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Anansix

USA . 2,520 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

-

2,520

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,326 parts In-Stock

1+ parts

$5.471

100+ parts

-

1k+ parts

$4.924

10k+ parts

-

2,326

$5.471

-

$4.924

-

MKK Technologies

India . 1,683 parts In-Stock

1+ parts

$10.288

100+ parts

-

1k+ parts

-

10k+ parts

-

1,683

$10.288

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-

-

DigiPath Technology Company

USA . 1,683 parts In-Stock

1+ parts

$10.288

100+ parts

-

1k+ parts

-

10k+ parts

-

1,683

$10.288

-

-

-

Microchip USA

USA . 201 parts In-Stock

1+ parts

$18.922

100+ parts

-

1k+ parts

-

10k+ parts

-

201

$18.922

-

-

-

AZTECH Wire

Italy . 43 parts In-Stock

1+ parts

$19.660

100+ parts

-

1k+ parts

-

10k+ parts

-

43

$19.660

-

-

-

Corphita

USA . 3,285 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,285

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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Perfect Parts

USA . 1,708 parts In-Stock

1+ parts

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1k+ parts

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1,708

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Parana Technologies

USA . 485 parts In-Stock

1+ parts

-

100+ parts

$6.542

1k+ parts

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10k+ parts

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485

-

$6.542

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iodParts Technologies Inc.

India . 350 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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350

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Overview

Unlock the power of reliability with the VNQ830P-E from STMicroelectronics! This advanced peripheral driver combines exceptional performance with built-in protections against transient spikes, overcurrent, and thermal issues, ensuring your projects run smoothly. Ideal for automotive and industrial applications, this compact solution offers superior durability and efficiency, making it the perfect choice for engineers seeking quality and innovation in every design. Experience peace of mind and elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material enhances reliability and protects the internal components, making the product suitable for various operating conditions.

Surface Mount: YES

Being surface mount compatible allows for easier installation on PCBs, making it ideal for modern electronics where space efficiency is crucial.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage, this product can handle a wide range of applications, providing flexibility in various circuit designs.

No. of Functions: 4

The ability to perform four functions from a single chip reduces component count and simplifies the overall design.

Package Shape: RECTANGULAR

The rectangular package shape is useful for efficient space management on circuit boards, ensuring easy integration into existing layouts.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

These built-in protections significantly enhance the reliability and safety of the device, preventing damage under adverse conditions.

Power Supplies (V): 8/36

Support for multiple supply voltages increases versatility, enabling use in a wide variety of applications.

No. of Terminals: 28

With 28 terminals, this driver offers sufficient I/O options, making it suitable for complex applications requiring multiple connections.

Package Style (Meter): SMALL OUTLINE

The small outline form factor is advantageous for compact designs, saving valuable PCB space while maintaining functionality.

Minimum Supply Voltage: 5.5 V

The low minimum supply voltage allows for operation in battery-powered devices, making it ideal for portable applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality finish provides excellent conductivity and protects against corrosion, ensuring long-term reliability of connections.

Terminal Position: DUAL

Dual terminal positioning allows for greater flexibility in PCB layout, supporting various design preferences.

Maximum Seated Height: 2.65 mm

The low seated height helps maintain a low profile in designs, ensuring compatibility with various enclosure options.

Width: 7.5 mm

A narrow width makes the product suitable for space-constrained designs, allowing engineers to optimize their layouts.

Length: 17.9 mm

The length provides a compact solution for peripheral driving needs, fitting well in modern electronic applications.

Terminal Form: GULL WING

Gull wing terminals facilitate reliable surface mounting and offer excellent soldering characteristics, enhancing assembly quality.

Nominal Supply Voltage: 13 V

The nominal voltage of 13 V represents a balanced operating point for various applications while maximizing performance.

Terminal Pitch: 1.27 mm

The standard terminal pitch ensures compatibility with a wide range of PCB designs and simplifies layout and assembly.

Driver No. of Bits: 4

A 4-bit driver allows for efficient control and management of peripheral devices, optimizing performance in digital applications.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 suggests adequate handling and storage precautions, ensuring the product remains reliable even after assembly.

Nominal Output Peak Current Limit: 9 A

With a high output peak current limit of 9 A, this driver delivers powerful performance for demanding applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface flexibility as a buffer or inverter driver makes this product suitable for a wide range of signal processing applications.

Output Current Flow Direction: SOURCE

The source current flow direction simplifies design considerations for driving loads, ensuring compatibility with various connected devices.

Technical Specifications

Peripheral Drivers VNQ830P-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

28

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

VNQ830P-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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