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VNQ830-E

STMicroelectronics

VNQ830-E by STMicroelectronics

VNQ830-E by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V, supporting up to 6A output current. It features built-in protections against overcurrent and thermal issues, making it ideal for automotive applications. Its compact design (28 terminals) ensures efficient integration in space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,304 parts In-Stock

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3,304

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Anansix

USA . 1,933 parts In-Stock

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1,933

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Digiode

USA . 809 parts In-Stock

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809

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ComSIT Distribution GmbH

Germany . 32 parts In-Stock

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32

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ComSIT USA

USA . 32 parts In-Stock

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32

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Freelance Electronics

USA . 2 parts In-Stock

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2

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,062 parts In-Stock

1+ parts

$2.810

100+ parts

-

1k+ parts

$2.529

10k+ parts

-

1,062

$2.810

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$2.529

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MKK Technologies

India . 447 parts In-Stock

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$5.283

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447

$5.283

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DigiPath Technology Company

USA . 447 parts In-Stock

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$5.283

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447

$5.283

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Advanced Electronics

New Zealand . 25 parts In-Stock

1+ parts

$7.166

100+ parts

$6.521

1k+ parts

$5.876

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25

$7.166

$6.521

$5.876

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AZTECH Wire

Italy . 682 parts In-Stock

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$8.330

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682

$8.330

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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QUARKTWIN TECHNOLOGY LTD

USA . 6,516 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,325 parts In-Stock

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Microchip USA

USA . 3,886 parts In-Stock

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Parana Technologies

USA . 2,326 parts In-Stock

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$3.359

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$3.359

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Metaverse IC Inc.

Canada . 2,000 parts In-Stock

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Corphita

USA . 1,605 parts In-Stock

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iodParts Technologies Inc.

India . 32 parts In-Stock

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32

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Overview

Experience the reliability and innovation of the VNQ830-E from STMicroelectronics, a leader in cutting-edge technology. This superior peripheral driver is designed for versatility, providing robust performance with built-in protections against overcurrent, voltage spikes, and thermal issues. Ideal for automotive and industrial applications, it ensures maximum efficiency and longevity. Choose quality and peace of mind with STMicroelectronics, where excellence meets value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making this peripheral driver reliable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient space utilization and easier integration into compact designs.

Maximum Supply Voltage: 36 V

A high maximum supply voltage capability ensures compatibility with a wide range of systems and applications.

No. of Functions: 4

Multiple functions optimize performance, allowing versatile applications in various electronics.

Package Shape: RECTANGULAR

The rectangular shape provides an efficient footprint for heat dissipation and effective layout in circuit designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections enhance reliability by safeguarding against various electrical failures.

Power Supplies (V): 8/36

Supports a wide voltage range, ensuring flexibility in different power supply environments.

No. of Terminals: 28

A higher number of terminals allows for more complex connections, enhancing versatility in circuit designs.

Package Style (Meter): SMALL OUTLINE

Compact small outline package style fits easily into space-constrained designs while still providing good performance.

Minimum Supply Voltage: 5.5 V

The minimum voltage requirement of 5.5 V allows for operation in lower-voltage applications, increasing design flexibility.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Premium terminal finish ensures excellent conductivity and long-term reliability in signal transmission.

Terminal Position: DUAL

Dual terminal positioning promotes ease of integration and efficient routing within PCB layouts.

Maximum Seated Height: 2.65 mm

A low seated height allows for designs with minimal vertical profile, ideal for modern compact electronics.

Width: 7.5 mm

A width of 7.5 mm strikes a balance between compactness and the space required for optimal thermal management.

Maximum Time At Peak Reflow Temperature (s): 30

Extended reflow time tolerances facilitate better solder quality during assembly, enhancing product reliability.

Peak Reflow Temperature °C: 250

High reflow temperature capability ensures compatibility with various solder materials, supporting diverse manufacturing processes.

Length: 17.9 mm

The length is suitable for various designs, maintaining a precise balance between components on the PCB.

Maximum Output Current: 6 A

Capacity to handle a maximum output current of 6 A makes it suitable for powering demanding peripherals.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and ease of soldering, essential for manufacturing efficiency.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V is ideal for many common electronic applications, ensuring robust performance.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is standard for many designs, providing ease of integration into existing layouts.

Driver No. of Bits: 4

Having 4 bits allows for better control and precision in driving peripheral devices.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, suggesting appropriate handling and storage for reliable performance.

Nominal Output Peak Current Limit: 9 A

The 9 A peak current limit allows this driver to handle pulse currents effectively, making it ideal for high-demand applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Buffer or inverter-based design capabilities improve signal integrity and driving efficiency for connected devices.

Output Current Flow Direction: SOURCE

Being a source type output current flow driver maximizes versatility in applications requiring power sourcing capability.

Technical Specifications

Peripheral Drivers VNQ830-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

28

Output Current Flow Direction:

SOURCE

Maximum Output Current:

6 A

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VNQ830-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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