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VND5025LAK-E

STMicroelectronics

VND5025LAK-E by STMicroelectronics

VND5025LAK-E by STMicroelectronics is a CMOS peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent, overvoltage, and thermal issues. It features a compact 24-terminal design for efficient surface mounting. Ideal for automotive and industrial applications requiring reliable power management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,655 parts In-Stock

1+ parts

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3,655

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Digiode

USA . 1,509 parts In-Stock

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1,509

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Anansix

USA . 1,090 parts In-Stock

1+ parts

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1,090

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Martec Srl

Italy . 46 parts In-Stock

1+ parts

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46

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Cyclops Electronics Ltd

UK . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 151 parts In-Stock

1+ parts

$4.065

100+ parts

-

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151

$4.065

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IDEA Electronic Components Group

UK . 642 parts In-Stock

1+ parts

$8.697

100+ parts

-

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$7.827

10k+ parts

-

642

$8.697

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$7.827

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AZTECH Wire

Italy . 175 parts In-Stock

1+ parts

$14.050

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175

$14.050

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MKK Technologies

India . 1,721 parts In-Stock

1+ parts

$16.354

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1,721

$16.354

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DigiPath Technology Company

USA . 1,721 parts In-Stock

1+ parts

$16.354

100+ parts

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1,721

$16.354

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QUARKTWIN TECHNOLOGY LTD

USA . 23,820 parts In-Stock

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23,820

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A-Z Elektronik GmbH

Germany . 4,571 parts In-Stock

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4,571

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Corphita

USA . 4,287 parts In-Stock

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4,287

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Parana Technologies

USA . 1,074 parts In-Stock

1+ parts

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$10.398

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1,074

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$10.398

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iodParts Technologies Inc.

India . 350 parts In-Stock

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350

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Overview

Elevate your designs with the VND5025LAK-E from STMicroelectronics, a leader in high-performance semiconductor solutions. This versatile peripheral driver combines robust built-in protections against overcurrent, overvoltage, and thermal issues, ensuring reliability in demanding applications. With its compact design and efficient power handling capabilities, it empowers engineers to create innovative, safe, and energy-efficient systems. Trust STMicroelectronics for quality that drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material helps to ensure durability and resilience against environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact electronic designs, maximizing space efficiency in modern applications.

Maximum Supply Voltage: 36 V

With a maximum supply voltage of 36 V, this driver can handle a wide range of input voltages, making it suitable for diverse operational environments.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient layout and placement on PCBs, improving overall design flexibility.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The extensive built-in protections ensure reliability and safe operation under varying conditions, reducing the risk of damage and enhancing longevity.

Power Supplies (V): 8/36

Supporting a broad range of power supply voltages increases versatility, enabling the driver to accommodate multiple system designs and applications.

No. of Terminals: 24

A higher number of terminals allows for more comprehensive connectivity options, making it easier to interface with complex systems.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design facilitate space-saving on the PCB, aligning with the trends towards smaller and more compact electronic devices.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage allows the driver to operate in low-power applications, expanding its usability across different devices and energy-efficient systems.

Terminal Position: DUAL

The dual terminal position provides flexible mounting options on PCBs, enhancing ease of installation and layout design.

Maximum Seated Height: 2.22 mm

A low maximum seated height ensures that the driver can fit into compact designs and meet modern aesthetic and functional requirements.

Width: 7.5 mm

A compact width allows for more efficient use of space on the PCB, facilitating denser circuit designs.

Length: 10.3 mm

The short length helps in reducing the footprint on the PCB, allowing for closer placement of other components.

Technology: CMOS

The CMOS technology enhances power efficiency and speed, making the product suitable for high-performance applications with lower power requirements.

Terminal Form: GULL WING

Gull wing terminals provide robust mechanical support and reliable solder joint characteristics, ensuring stability under physical stress.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13 V provides an optimal operating condition, balancing performance and efficiency for typical applications.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm is suitable for high-density applications, enabling greater connectivity without compromising on circuit integrity.

Driver No. of Bits: 2

The two-bit driver capacity is capable of controlling multiple outputs with simplicity, making it efficient for basic control tasks.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer or inverter based driver ensures versatile interfacing options, which is essential for handling various signal types effectively.

Output Current Flow Direction: SOURCE

The source output current flow direction is beneficial for driving loads directly, simplifying design and enhancing performance.

Technical Specifications

Peripheral Drivers VND5025LAK-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G24

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

24

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.22 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

VND5025LAK-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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