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VND05B(011Y)

STMicroelectronics

VND05B(011Y) by STMicroelectronics

VND05B(011Y) by STMicroelectronics is a robust peripheral driver with a max supply voltage of 26V, supporting automotive applications. It features built-in protections against overcurrent and thermal issues, ensuring reliability. With a max output current of 2.6A, it excels in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,662 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,662

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-

-

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Anansix

USA . 2,351 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,351

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Digiode

USA . 2,122 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,122

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 878 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

-

10k+ parts

-

878

$2.500

-

-

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IDEA Electronic Components Group

UK . 2,229 parts In-Stock

1+ parts

$11.317

100+ parts

-

1k+ parts

$10.185

10k+ parts

-

2,229

$11.317

-

$10.185

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MKK Technologies

India . 1,772 parts In-Stock

1+ parts

$21.281

100+ parts

-

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10k+ parts

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1,772

$21.281

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DigiPath Technology Company

USA . 1,772 parts In-Stock

1+ parts

$21.281

100+ parts

-

1k+ parts

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10k+ parts

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1,772

$21.281

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-

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Microchip USA

USA . 102 parts In-Stock

1+ parts

$27.637

100+ parts

-

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10k+ parts

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102

$27.637

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Corphita

USA . 2,932 parts In-Stock

1+ parts

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2,932

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Parana Technologies

USA . 127 parts In-Stock

1+ parts

-

100+ parts

$13.531

1k+ parts

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10k+ parts

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127

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$13.531

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Overview

Unlock unparalleled performance with the VND05B(011Y) by STMicroelectronics, a top-tier choice in peripheral drivers renowned for reliability and cutting-edge quality. Designed for automotive applications, this robust solution features built-in protections against overcurrent, thermal issues, and voltage fluctuations, ensuring your systems operate seamlessly under all conditions. Experience enhanced efficiency and peace of mind with STMicroelectronics’ commitment to excellence, putting innovation at your fingertips!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making this peripheral driver suitable for various applications.

Maximum Supply Voltage: 26 V

With a high maximum supply voltage, this driver can handle demanding applications and is compatible with a wide range of power supplies.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space utilization on circuit boards, making it ideal for compact designs.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

These built-in protections enhance reliability and safety, preventing damage to the driver and connected components in various operating conditions.

Power Supplies (V): 8/16

Support for multiple power supply voltages (8V and 16V) provides flexibility for integration into different systems.

No. of Terminals: 7

Having 7 terminals allows for versatile connections and greater functionality in various applications.

Package Style (Meter): FLANGE MOUNT

The flange mount style enhances the stability of the mounting process, ensuring reliability in automotive and other applications.

Minimum Supply Voltage: 6 V

The low minimum supply voltage enables operation in power-sensitive applications, increasing efficiency.

Maximum Operating Temperature: 125 °C

Withstanding high temperatures makes this driver suitable for demanding environments, such as automotive applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures ensures reliable performance in frigid conditions, making it ideal for a broad range of applications.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and enhances the durability of the connections.

Terminal Position: ZIG-ZAG

The zig-zag terminal positioning allows for efficient space management and easier layout design on PCBs.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive applications, ensuring high reliability and performance under various automotive conditions.

Maximum Output Current: 2.6 A

A high output current capability enables the driver to power devices requiring substantial current, enhancing its versatility.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and ensure robust connections in high-vibration environments.

Nominal Supply Voltage: 13 V

Operating at a nominal voltage of 13V makes it suitable for standard automotive and industrial applications.

Turn-on Time: 200 us

A fast turn-on time improves response and efficiency in switching applications, crucial for dynamic systems.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch offers compatibility with a variety of PCB designs and enhances layout flexibility.

Driver No. of Bits: 2

Supporting 2 bits enables the driver to handle basic control schemes efficiently.

Nominal Output Peak Current Limit: 1.6 A

The peak current limit ensures safe operation and prevents damage due to overcurrent situations.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This versatility allows for a range of interfacing options, making it suitable for various digital logic applications.

Turn-off Time: 250 us

Quick turn-off time enhances overall system performance in time-critical applications.

Output Current Flow Direction: SOURCE

A source current flow direction allows for powering downstream devices directly, simplifying circuit design.

Technical Specifications

Peripheral Drivers VND05B(011Y) attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PZFM-T7

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Maximum Output Current:

2.6 A

Nominal Output Peak Current Limit:

1.6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP7H,.2,.7TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

8/16

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

26 V

Minimum Supply Voltage:

6 V

Nominal Supply Voltage:

13 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Turn-off Time:

250 us

Turn-on Time:

200 us

Trade Compliance

VND05B(011Y) Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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