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VND05B(012Y)

STMicroelectronics

VND05B(012Y) by STMicroelectronics

VND05B(012Y) by STMicroelectronics is a robust peripheral driver with a max supply voltage of 26V and an output current of 2.6A, ideal for automotive applications. It features built-in protections against transient, overcurrent, and thermal issues. Operating b/w -40 °C to 125 °C ensures reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,275 parts In-Stock

1+ parts

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1k+ parts

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4,275

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Vyrian

USA . 2,600 parts In-Stock

1+ parts

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2,600

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Anansix

USA . 1,645 parts In-Stock

1+ parts

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1,645

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 27 parts In-Stock

1+ parts

$13.719

100+ parts

-

1k+ parts

$12.347

10k+ parts

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27

$13.719

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$12.347

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Microchip USA

USA . 242 parts In-Stock

1+ parts

$24.658

100+ parts

-

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242

$24.658

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MKK Technologies

India . 475 parts In-Stock

1+ parts

$25.798

100+ parts

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475

$25.798

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DigiPath Technology Company

USA . 475 parts In-Stock

1+ parts

$25.798

100+ parts

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475

$25.798

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Component Stockers USA

USA . 261 parts In-Stock

1+ parts

$99.990

100+ parts

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261

$99.990

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Corphita

USA . 3,289 parts In-Stock

1+ parts

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3,289

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Parana Technologies

USA . 277 parts In-Stock

1+ parts

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100+ parts

$16.403

1k+ parts

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277

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$16.403

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Overview

Unlock the potential of your automotive projects with the VND05B(012Y) from STMicroelectronics. Renowned for their cutting-edge innovation and reliability, STMicroelectronics delivers a driver that ensures robust performance under extreme conditions. With built-in protections against transients and overcurrent, this device guarantees peace of mind while powering your applications. Experience seamless operation, exceptional durability, and the superior quality that only STMicroelectronics can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures a strong, durable housing that protects the internal components, while being lightweight.

Maximum Supply Voltage: 26 V

A maximum supply voltage of 26 V allows this peripheral driver to be compatible with a wide range of applications and systems.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient space utilization on printed circuit boards, making it easier to integrate into various designs.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

These built-in protection features enhance reliability and safety, minimizing the risk of damage from unexpected electrical disturbances.

Power Supplies (V): 8/16

Supporting 8V and 16V power supplies makes this peripheral driver versatile for different voltage levels in automotive and industrial applications.

No. of Terminals: 7

A 7-terminal design provides flexibility for different connection configurations, making it suitable for various circuit designs.

Package Style (Meter): FLANGE MOUNT

Flange mounting allows ease of installation and mechanical stability, ensuring secure placement in the final application.

Minimum Supply Voltage: 6 V

With a minimum supply voltage of 6 V, it is suitable for low-power applications, increasing its utility in battery-operated devices.

Maximum Operating Temperature: 125 °C

The ability to operate at temperatures up to 125 °C makes it ideal for automotive applications where heat dissipation is critical.

Minimum Operating Temperature: -40 °C

Operating as low as -40 °C ensures performance in extreme environments, crucial for outdoor and automotive applications.

Terminal Finish: TIN LEAD

Tin-lead terminal finish ensures good solderability and durability, enhancing connection reliability in critical circuits.

Terminal Position: SINGLE

Single terminal positions simplify layout design and make integration into circuits straightforward.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive temperature grades guarantees performance standards necessary for vehicle applications.

Maximum Output Current: 2.6 A

A maximum output current of 2.6 A allows it to drive various loads effectively, suitable for powering automotive peripherals.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connections to the PCB, enhancing overall device reliability.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V is typical for automotive systems, ensuring compatibility with standard vehicle power supplies.

Turn-on Time: 200 us

Quick turn-on time of 200 microseconds enhances system performance by minimizing response delays in driving applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm offers compact layouts, making it easier to fit into designs with limited space.

Driver No. of Bits: 2

The 2-bit driver capability supports various data processing needs efficiently, making it adaptable for multiple control scenarios.

Nominal Output Peak Current Limit: 1.6 A

Limiting the peak output current to 1.6 A prevents damage to connected components and ensures safe operation under load.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This configuration allows the driver to work effectively in various circuit layouts, providing versatility in design.

Turn-off Time: 250 us

A turn-off time of 250 microseconds allows for efficient signal processing, contributing to the overall performance of electronic systems.

Output Current Flow Direction: SOURCE

The source output current flow direction is well-suited for many applications, allowing the driver to supply power efficiently.

Technical Specifications

Peripheral Drivers VND05B(012Y) attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PSFM-T7

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Maximum Output Current:

2.6 A

Nominal Output Peak Current Limit:

1.6 A

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP7,.1,50TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

8/16

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

26 V

Minimum Supply Voltage:

6 V

Nominal Supply Voltage:

13 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Turn-off Time:

250 us

Turn-on Time:

200 us

Trade Compliance

VND05B(012Y) Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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