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VND05BSP

STMicroelectronics

VND05BSP by STMicroelectronics

VND05BSP by STMicroelectronics is a peripheral driver with 10 terminals, operating voltage range of 6-26 V, and built-in protections for transient, over current, thermal, and under voltage. It is designed for automotive applications with small outline package style and Schmitt trigger input characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,240 parts In-Stock

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Flip Electronics

USA . 5,000 parts In-Stock

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5,000

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Digiode

USA . 2,920 parts In-Stock

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2,920

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Anansix

USA . 1,978 parts In-Stock

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1,978

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LIBRA Elektronik GmbH

Germany . 208 parts In-Stock

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LittleDiode

UK . 1 parts In-Stock

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IDEA Electronic Components Group

UK . 1,940 parts In-Stock

1+ parts

$8.444

100+ parts

-

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$7.599

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1,940

$8.444

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$7.599

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AZTECH Wire

Italy . 1,152 parts In-Stock

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$10.850

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$10.850

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MKK Technologies

India . 798 parts In-Stock

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$15.878

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798

$15.878

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DigiPath Technology Company

USA . 798 parts In-Stock

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$15.878

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798

$15.878

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QUARKTWIN TECHNOLOGY LTD

USA . 14,965 parts In-Stock

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14,965

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Microchip USA

USA . 5,266 parts In-Stock

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Corphita

USA . 3,577 parts In-Stock

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3,577

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A-Z Elektronik GmbH

Germany . 2,604 parts In-Stock

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Perfect Parts

USA . 1,108 parts In-Stock

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Parana Technologies

USA . 913 parts In-Stock

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$10.096

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913

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$10.096

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Metaverse IC Inc.

Canada . 529 parts In-Stock

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529

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iodParts Technologies Inc.

India . 350 parts In-Stock

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350

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Overview

Enhance the performance of your electronic devices with the VND05BSP by STMicroelectronics, a top-notch peripheral driver known for its reliability and durability. Designed with built-in protections for transient events, over current situations, thermal issues, and under voltage conditions, this product ensures the safety of your equipment. Its small outline, heat sink/slub package style makes it ideal for automotive applications. With a true output polarity and open-source characteristics, the VND05BSP provides efficient and effective operation. Trust STMicroelectronics to deliver quality products that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable applications.

Maximum Supply Voltage: 26 V

Ability to handle a high voltage input makes this peripheral driver versatile and compatible with a wide range of electronic devices.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety and longevity of both the peripheral driver and the connected devices by preventing damage from various electrical faults.

Output Characteristics: OPEN-SOURCE

The open-source output characteristic allows for easy integration with other components, making it flexible and customizable for different applications.

Temperature Grade: AUTOMOTIVE

Designed to operate in automotive environments, this peripheral driver is suitable for use in vehicles where temperature fluctuations are common.

Nominal Output Peak Current Limit: 2.6 A

The high output peak current limit enables this peripheral driver to drive power-hungry devices without the risk of overheating or overloading.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input characteristics ensure a clean and precise signal input, reducing the chances of errors or signal interference.

Technical Specifications

Peripheral Drivers VND05BSP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Input Characteristics:

SCHMITT TRIGGER

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-SOURCE

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

2.6 A

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Maximum Supply Current:

.1 mA

Maximum Supply Voltage:

26 V

Minimum Supply Voltage:

6 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

250 us

Turn-on Time:

200 us

Width:

7.5 mm

Trade Compliance

VND05BSP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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