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VND05BSP13TR

STMicroelectronics

VND05BSP13TR by STMicroelectronics

VND05BSP13TR from STMicroelectronics is a robust peripheral driver with a max supply voltage of 26V and built-in protections against overcurrent, thermal issues, and transients. It operates in extreme temperatures from -40 °C to 125°C, making it ideal for automotive applications. This compact device features a dual terminal design and offers open-source output characteristics for versatile integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,273 parts In-Stock

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6,273

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Digiode

USA . 1,875 parts In-Stock

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1,875

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Anansix

USA . 1,873 parts In-Stock

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1,873

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ACDS - Activité Composants Distribution Service

France . 180 parts In-Stock

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180

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ComSIT Distribution GmbH

Germany . 117 parts In-Stock

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117

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,142 parts In-Stock

1+ parts

$11.137

100+ parts

-

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$10.023

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1,142

$11.137

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$10.023

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AZTECH Wire

Italy . 1,010 parts In-Stock

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$14.290

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1,010

$14.290

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MKK Technologies

India . 1,552 parts In-Stock

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$20.942

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1,552

$20.942

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DigiPath Technology Company

USA . 1,552 parts In-Stock

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$20.942

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1,552

$20.942

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Component Stockers USA

USA . 250 parts In-Stock

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$99.990

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250

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 26,973 parts In-Stock

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26,973

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Microchip USA

USA . 4,334 parts In-Stock

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Corphita

USA . 2,825 parts In-Stock

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RC Electronics

USA . 2,700 parts In-Stock

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2,700

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Parana Technologies

USA . 1,733 parts In-Stock

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$13.316

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$13.316

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Perfect Parts

USA . 1,344 parts In-Stock

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iodParts Technologies Inc.

India . 125 parts In-Stock

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125

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Overview

Unlock unparalleled performance with the VND05BSP13TR from STMicroelectronics. This robust peripheral driver excels in automotive applications, ensuring reliability with built-in protections against transients, overcurrent, and thermal issues. Crafted by a leader in innovation, it guarantees efficiency and longevity, helping you design smarter products with ease. Experience peace of mind knowing your projects are supported by cutting-edge technology that delivers exceptional value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and provides a lightweight design, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier and more compact PCB design, saving space in electronic devices.

Maximum Supply Voltage: 26 V

The high maximum supply voltage makes this peripheral driver versatile for a range of applications.

Package Shape: RECTANGULAR

The rectangular shape is optimal for efficient layout on PCBs and improves packing density.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Multiple built-in protections ensure reliability and longevity of the device in various environmental conditions.

No. of Terminals: 10

With 10 terminals, this driver facilitates multiple connections, enabling versatile circuit designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline with heat sink support allows for effective thermal management while keeping a compact profile.

Minimum Supply Voltage: 6 V

This low minimum voltage requirement allows for efficient operation in battery-powered devices.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature rating ensures reliability in automotive and industrial applications.

Output Characteristics: OPEN-SOURCE

Open-source output characteristics enable flexibility in interfacing with various components.

Minimum Operating Temperature: -40 °C

The capability to operate at very low temperatures makes this product suitable for harsh environments.

Terminal Finish: MATTE TIN

The matte tin finish improves solderability and enhances the overall reliability of connections.

Terminal Position: DUAL

Dual terminal positioning increases design flexibility and enhances connectivity options.

Maximum Seated Height: 3.75 mm

With a low maximum seated height, this component is easily integrable into compact designs.

Width: 7.5 mm

A compact width allows for better fit and design integration in space-constrained applications.

Output Polarity: TRUE

True output polarity supports common logic configurations, enhancing compatibility with other components.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time that ensures safe assembly without damaging the component.

Peak Reflow Temperature °C: 250

The high reflow temperature specification allows compatibility with lead-free soldering processes.

Length: 9.4 mm

A compact length ensures it can fit well into tight circuit layouts.

Temperature Grade: AUTOMOTIVE

Rated for automotive applications, this component guarantees reliability and performance in demanding environments.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and excellent mechanical stability on PCBs.

Maximum Supply Current: 0.1 mA

Very low supply current helps conserve power, making this driver ideal for energy-sensitive applications.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics improve signal integrity and reduce noise sensitivity.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V ensures consistent performance in varying conditions.

Turn-on Time: 200 us

Fast turn-on time enhances response in high-speed applications, improving overall system performance.

Terminal Pitch: 1.27 mm

The standard terminal pitch promotes ease of soldering and allows for compatibility with various PCB designs.

Moisture Sensitivity Level (MSL): 3

An MSL level of 3 indicates moderate handling precautions, ensuring reliability during manufacturing.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This type of interface supports a wide range of applications, from buffering to signal inversion.

Turn-off Time: 250 us

Quick turn-off time contributes to the overall efficiency and performance of electronic systems.

Output Current Flow Direction: SINK

The ability to sink current improves the versatility of the peripheral driver in various circuit configurations.

Technical Specifications

Peripheral Drivers VND05BSP13TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Input Characteristics:

SCHMITT TRIGGER

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-SOURCE

Output Current Flow Direction:

SINK

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Maximum Supply Current:

.1 mA

Maximum Supply Voltage:

26 V

Minimum Supply Voltage:

6 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

250 us

Turn-on Time:

200 us

Width:

7.5 mm

Trade Compliance

VND05BSP13TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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