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VN920PEP-E

STMicroelectronics

VN920PEP-E by STMicroelectronics

VN920PEP-E by STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V and output current up to 10A. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,760 parts In-Stock

1+ parts

-

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6,760

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Euro-Tech

UK . 1,175 parts In-Stock

1+ parts

-

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-

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1,175

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Digiode

USA . 816 parts In-Stock

1+ parts

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816

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Anansix

USA . 558 parts In-Stock

1+ parts

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558

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 923 parts In-Stock

1+ parts

$8.700

100+ parts

-

1k+ parts

-

10k+ parts

-

923

$8.700

-

-

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IDEA Electronic Components Group

UK . 1,398 parts In-Stock

1+ parts

$13.467

100+ parts

-

1k+ parts

$12.120

10k+ parts

-

1,398

$13.467

-

$12.120

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Microchip USA

USA . 2,245 parts In-Stock

1+ parts

$15.413

100+ parts

-

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2,245

$15.413

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MKK Technologies

India . 524 parts In-Stock

1+ parts

$25.324

100+ parts

-

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524

$25.324

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DigiPath Technology Company

USA . 524 parts In-Stock

1+ parts

$25.324

100+ parts

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524

$25.324

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Component Stockers USA

USA . 563 parts In-Stock

1+ parts

$99.990

100+ parts

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563

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 17,975 parts In-Stock

1+ parts

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17,975

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Lixinc

USA . 3,005 parts In-Stock

1+ parts

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3,005

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Corphita

USA . 2,860 parts In-Stock

1+ parts

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2,860

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Parana Technologies

USA . 1,866 parts In-Stock

1+ parts

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100+ parts

$16.102

1k+ parts

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10k+ parts

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1,866

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$16.102

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Overview

Unlock unparalleled performance with the VN920PEP-E from STMicroelectronics! Designed for reliability, this peripheral driver excels in demanding applications, providing built-in protections against common failures. Enjoy seamless integration with its compact design, making it perfect for automotive, industrial, and consumer electronics. Trust in STMicroelectronics’ legacy of quality to elevate your projects, ensuring safety and efficiency for maximum peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent mechanical and thermal properties, ensuring reliable performance in various environments.

Surface Mount: YES

Surface mount capability allows for efficient PCB space utilization and automated assembly processes, making it suitable for modern electronics.

Maximum Supply Voltage: 36 V

With a maximum supply voltage of 36 V, this driver can handle a wide range of applications and devices, offering versatility in various designs.

Package Shape: RECTANGULAR

The rectangular package shape provides a good footprint for compact layouts, allowing for better integration into space-constrained designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections enhance reliability by preventing damage from common issues like overcurrent and voltage spikes.

Power Supplies (V): 8/36

The ability to operate within a power supply range of 8 to 36 V makes this driver flexible for various applications, adapting to different power requirements.

No. of Terminals: 24

Having 24 terminals allows for extensive connectivity options, facilitating integration into complex circuits and multiple peripherals.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline design with heat sink and slug options ensures efficient thermal management and compact layouts for high-density applications.

Minimum Supply Voltage: 5.5 V

A minimum supply voltage of 5.5 V allows for operation in low-voltage applications, making this driver suitable for battery-operated devices.

Terminal Finish: MATTE TIN

The matte tin terminal finish ensures good solderability and corrosion resistance, enhancing durability and longevity of the connections.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in PCB layouts, simplifying assembly and improving signal routing options.

Maximum Seated Height: 2.47 mm

The low maximum seated height of 2.47 mm allows for slimmer profiles in designs, which is ideal for compact electronic devices.

Width: 7.5 mm

A width of 7.5 mm strikes a balance between compactness and accommodation of necessary terminals, fitting well in tight spaces.

Length: 10.3 mm

The length of 10.3 mm contributes to an overall small footprint, making this driver suitable for high-density applications.

Maximum Output Current: 10 A

A maximum output current of 10 A enables the driver to support high-power applications, providing reliability for demanding peripherals.

Terminal Form: GULL WING

Gull wing terminal form enhances soldering reliability and reduces mechanical stress on the joints, ensuring a sturdy connection.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13 V is optimal for many applications, ensuring that connected devices operate efficiently.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for compact layouts while ensuring adequate spacing for connections, optimizing board real estate.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product can be stored for extended periods without moisture concerns, ensuring longevity before use.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This driver type is designed for versatile interfacing, supporting a wide range of peripheral devices with ease.

Output Current Flow Direction: SOURCE

The source output current flow direction allows for effective control of peripheral devices, providing versatility in application designs.

Technical Specifications

Peripheral Drivers VN920PEP-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Output Current Flow Direction:

SOURCE

Maximum Output Current:

10 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.47 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

VN920PEP-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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