Loading...

VN820SOTR-E

STMicroelectronics

VN820SOTR-E by STMicroelectronics

VN820SOTR-E by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V and supports output currents up to 9A. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,486 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,486

-

-

-

-

Anansix

USA . 985 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

985

-

-

-

-

Vyrian

USA . 812 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

812

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,724 parts In-Stock

1+ parts

$2.823

100+ parts

-

1k+ parts

$2.540

10k+ parts

-

1,724

$2.823

-

$2.540

-

MKK Technologies

India . 650 parts In-Stock

1+ parts

$5.308

100+ parts

-

1k+ parts

-

10k+ parts

-

650

$5.308

-

-

-

DigiPath Technology Company

USA . 650 parts In-Stock

1+ parts

$5.308

100+ parts

-

1k+ parts

-

10k+ parts

-

650

$5.308

-

-

-

Corphita

USA . 4,375 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,375

-

-

-

-

Parana Technologies

USA . 261 parts In-Stock

1+ parts

-

100+ parts

$3.375

1k+ parts

-

10k+ parts

-

261

-

$3.375

-

-

Overview

Elevate your designs with the VN820SOTR-E from STMicroelectronics, a powerhouse in peripheral drivers that combines reliability with advanced protection features. Designed to withstand extreme conditions, this compact device ensures optimal performance across various applications while simplifying your circuit design. Trust in STMicroelectronics’ legacy of quality to enhance efficiency and longevity—transforming your projects into industry-leading solutions. Experience innovation at its finest!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient usage of space on PCBs, making it ideal for modern electronic devices.

Maximum Supply Voltage: 36 V

A maximum supply voltage of 36 V provides flexibility in application, accommodating a wider range of circuit designs.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space utilization and alignment on printed circuit boards.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections ensure reliability and safety, reducing the risk of component damage during operation.

Power Supplies (V): 8/36

Compatible with a range of supply voltages (8V to 36V), making it versatile for different applications.

No. of Terminals: 16

Having 16 terminals enhances connection options, facilitating easy integration into complex circuit designs.

Package Style (Meter): SMALL OUTLINE

Small outline packaging contributes to a compact design, perfect for space-constrained applications.

Minimum Supply Voltage: 5.5 V

The minimum supply voltage of 5.5 V allows for operation in lower voltage environments, increasing its applicability.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances solderability and provides better electrical conductivity and longevity.

Terminal Position: DUAL

Dual terminal positioning allows for easier assembly and better performance in various orientations.

Maximum Seated Height: 1.75 mm

A low seated height is advantageous for low-profile designs, fitting easily into compact devices.

Width: 3.9 mm

The narrow width lends to efficient space usage on PCBs, supporting intricate layouts.

Length: 9.9 mm

A moderate length helps in maintaining a balanced design while providing adequate functionality.

Maximum Output Current: 9 A

The ability to handle up to 9 A output current makes this driver suitable for powering high-demand peripherals.

Technology: MOS

Using MOS technology ensures low switching losses and high efficiency, making it suitable for high-frequency applications.

Terminal Form: GULL WING

The gull wing terminal form enhances mechanical strength and is ideal for surface mount technology.

Nominal Supply Voltage: 13 V

Operating at a nominal supply voltage of 13 V is optimal for many peripheral devices, promoting stability and performance.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard, making it compatible with common PCB designs and facilitating easier integration.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, ensuring appropriate handling guidelines for reliable performance.

Nominal Output Peak Current Limit: 13 A

With a peak output current limit of 13 A, it can manage brief overloads, making it resilient under demanding conditions.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This type of interface provides flexibility in application, effectively interfacing with various parts of a system.

Output Current Flow Direction: SOURCE

The source output current flow direction is suitable for many applications where the driver needs to provide power to peripherals.

Technical Specifications

Peripheral Drivers VN820SOTR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Output Current Flow Direction:

SOURCE

Maximum Output Current:

9 A

Nominal Output Peak Current Limit:

13 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

VN820SOTR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19