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VN820SO-E

STMicroelectronics

VN820SO-E by STMicroelectronics

VN820SO-E by STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V and supports output currents up to 13A. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,452 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,452

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-

-

-

Anansix

USA . 1,226 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,226

-

-

-

-

Vyrian

USA . 819 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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819

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,429 parts In-Stock

1+ parts

$3.892

100+ parts

-

1k+ parts

$3.502

10k+ parts

-

1,429

$3.892

-

$3.502

-

MKK Technologies

India . 213 parts In-Stock

1+ parts

$7.318

100+ parts

-

1k+ parts

-

10k+ parts

-

213

$7.318

-

-

-

DigiPath Technology Company

USA . 213 parts In-Stock

1+ parts

$7.318

100+ parts

-

1k+ parts

-

10k+ parts

-

213

$7.318

-

-

-

Corphita

USA . 4,511 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,511

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-

-

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Parana Technologies

USA . 2,006 parts In-Stock

1+ parts

-

100+ parts

$4.653

1k+ parts

-

10k+ parts

-

2,006

-

$4.653

-

-

Overview

Elevate your designs with the VN820SO-E from STMicroelectronics, a leader in innovative solutions. This compact peripheral driver combines robust performance and advanced protection features like overcurrent and thermal safeguards, ensuring reliability in demanding applications. With its high output current capabilities and versatile supply voltage range, it empowers seamless integration into automotive, industrial, and consumer electronics, delivering exceptional value and peace of mind for engineers and manufacturers alike.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology enables compact designs and easier integration into modern electronic circuits, enhancing assembly efficiency.

Maximum Supply Voltage: 36 V

A maximum supply voltage of 36V provides versatility in applications, allowing it to power a wide range of peripheral devices.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, making it ideal for high-density designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Integrated protection features enhance reliability and longevity, safeguarding the device against common electrical issues.

Power Supplies (V): 8/36

The wide range of power supply options (8V to 36V) allows this product to be used in diverse applications, accommodating various systems.

No. of Terminals: 16

16 terminals provide ample connectivity options, enabling more complex circuit designs and interactions with multiple components.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures that the component can be easily fitted into space-constrained environments.

Minimum Supply Voltage: 5.5 V

A minimum supply voltage of 5.5V facilitates compatibility with low-voltage systems, broadening the range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance, ensuring stable performance over time.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout options on the PCB, simplifying integration into existing designs.

Maximum Seated Height: 1.75 mm

With a low maximum seated height, this product can be embedded in slim-profile devices, favoring miniaturized designs.

Width: 3.9 mm

A compact width of 3.9mm contributes to space-saving designs, perfect for applications where size is a critical factor.

Length: 9.9 mm

The length of 9.9mm strikes a balance between performance and compactness, suitable for various electronic layouts.

Maximum Output Current: 9 A

The capability of delivering up to 9A of output current ensures this driver can handle demanding applications effectively.

Technology: MOS

Utilizing MOS technology provides faster switching speeds and higher efficiency, making it ideal for high-performance applications.

Terminal Form: GULL WING

Gull wing terminals simplify assembly and rework processes, offering added convenience during manufacturing and repairs.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13V optimizes performance, ensuring effective powering of connected devices.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch aids in fine-pitch PCB designs, allowing for more compact layouts without sacrificing performance.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate moisture sensitivity, enabling proper storage and handling techniques for reliability.

Nominal Output Peak Current Limit: 13 A

The ability to handle a nominal output peak current of 13A makes this driver suitable for high-load applications, ensuring peak performance.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer or inverter based peripheral driver allows for effective signal management, improving communication in electronic circuits.

Output Current Flow Direction: SOURCE

As a source type driver, it simplifies design considerations by directly supplying current to connected peripherals.

Technical Specifications

Peripheral Drivers VN820SO-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Output Current Flow Direction:

SOURCE

Maximum Output Current:

9 A

Nominal Output Peak Current Limit:

13 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

VN820SO-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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