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VN820SO13TR-E

STMicroelectronics

VN820SO13TR-E by STMicroelectronics

VN820SO13TR-E by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V and supports output currents up to 9A. It features built-in protections against transient, over/under voltage, and thermal issues. Ideal for applications requiring reliable MOS technology in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,363 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,363

-

-

-

-

Anansix

USA . 2,527 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,527

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-

-

-

Digiode

USA . 1,454 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,454

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 14 parts In-Stock

1+ parts

$4.475

100+ parts

-

1k+ parts

$4.027

10k+ parts

-

14

$4.475

-

$4.027

-

MKK Technologies

India . 1,005 parts In-Stock

1+ parts

$8.415

100+ parts

-

1k+ parts

-

10k+ parts

-

1,005

$8.415

-

-

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DigiPath Technology Company

USA . 1,005 parts In-Stock

1+ parts

$8.415

100+ parts

-

1k+ parts

-

10k+ parts

-

1,005

$8.415

-

-

-

Corphita

USA . 2,263 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,263

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-

-

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Parana Technologies

USA . 1,663 parts In-Stock

1+ parts

-

100+ parts

$5.350

1k+ parts

-

10k+ parts

-

1,663

-

$5.350

-

-

Overview

Elevate your designs with the VN820SO13TR-E from STMicroelectronics, a leader in innovation and quality. This robust peripheral driver ensures unmatched reliability for your applications, thanks to built-in protections against transients, over-voltage, and thermal issues. With its compact size and efficient performance, it seamlessly integrates into various systems, delivering consistent power management that enhances overall functionality and longevity. Choose STMicroelectronics for superior performance and peace of mind!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount capability allows for compact design, making it ideal for space-constrained applications.

Maximum Supply Voltage: 36 V

A high maximum supply voltage ensures compatibility with a wide range of systems and applications.

Package Shape: RECTANGULAR

The rectangular shape provides a standard footprint for easier integration into circuit designs.

Built-in Protections: TRANSIENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multiple built-in protections enhance reliability and safeguard against various operational risks.

Power Supplies (V): 8/36

Supports a flexible voltage range, allowing it to work with different power supply configurations.

No. of Terminals: 16

A 16-terminal design facilitates versatile connectivity options for complex circuit requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for high-density circuit boards, optimizing space utilization.

Minimum Supply Voltage: 5.5 V

The low minimum supply voltage ensures compatibility with lower voltage systems, broadening its application.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish promotes excellent conductivity and resistance to corrosion, enhancing longevity.

Terminal Position: DUAL

Dual terminal positioning simplifies soldering and improves thermal management, contributing to better performance.

Maximum Seated Height: 2.65 mm

The low profile height allows for better thermal conduction and integration into slim designs.

Width: 7.5 mm

Compact width enables more efficient use of PCB space without sacrificing performance.

Length: 10.3 mm

Short length contributes to minimized signal delay and improved electrical performance.

Maximum Output Current: 9 A

A high output current rating supports demanding applications, making it suitable for various devices.

Technology: MOS

MOS technology provides high efficiency and fast switching times, essential for modern circuits.

Terminal Form: GULL WING

Gull wing terminals offer easier manual soldering and automatic assembly, enhancing manufacturability.

Nominal Supply Voltage: 13 V

The nominal supply voltage is well-suited for many applications, ensuring optimal performance.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for precise placement and connection integrity on circuit boards.

Nominal Output Peak Current Limit: 13 A

Having a high nominal output peak current limit allows the product to handle transient load conditions effectively.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Versatile interface type allows for a wide range of applications, making it suitable for various peripheral drivers.

Output Current Flow Direction: SINK

Current sinking capability is essential for driving active loads, offering flexibility in system design.

Technical Specifications

Peripheral Drivers VN820SO13TR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

16

Output Current Flow Direction:

SINK

Maximum Output Current:

9 A

Nominal Output Peak Current Limit:

13 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

VN820SO13TR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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