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VN808CM

STMicroelectronics

VN808CM by STMicroelectronics

STMicroelectronics' VN808CM is a peripheral driver with 8 functions, operating at 10.5-32V. It offers built-in protections against transient, over current, thermal issues and under voltage. This small outline IC has a max output current of 0.012A and is ideal for buffer or inverter-based applications requiring a source flow direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,261 parts In-Stock

1+ parts

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7,261

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Chip Stock

USA . 5,100 parts In-Stock

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5,100

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Digiode

USA . 4,247 parts In-Stock

1+ parts

-

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4,247

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Anansix

USA . 2,302 parts In-Stock

1+ parts

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2,302

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

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50

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Fibra_Brandt Electronic GMBH

Germany . 10 parts In-Stock

1+ parts

-

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 215 parts In-Stock

1+ parts

$3.697

100+ parts

-

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-

10k+ parts

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215

$3.697

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-

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$9.447

100+ parts

$8.597

1k+ parts

$7.747

10k+ parts

-

1,000

$9.447

$8.597

$7.747

-

Aztec Data Supply Inc.

USA . 285 parts In-Stock

1+ parts

$11.550

100+ parts

-

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285

$11.550

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IDEA Electronic Components Group

UK . 505 parts In-Stock

1+ parts

$12.546

100+ parts

-

1k+ parts

$11.291

10k+ parts

-

505

$12.546

-

$11.291

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Ampacity Inc.

Singapore . 1,326 parts In-Stock

1+ parts

$13.500

100+ parts

-

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1,326

$13.500

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AZTECH Wire

Italy . 219 parts In-Stock

1+ parts

$19.054

100+ parts

-

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219

$19.054

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Microchip USA

USA . 193 parts In-Stock

1+ parts

$23.425

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193

$23.425

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MKK Technologies

India . 1,126 parts In-Stock

1+ parts

$23.592

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1,126

$23.592

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DigiPath Technology Company

USA . 1,126 parts In-Stock

1+ parts

$23.592

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1,126

$23.592

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RC Electronics

USA . 10,000 parts In-Stock

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Lixinc

USA . 8,017 parts In-Stock

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8,017

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A-Z Elektronik GmbH

Germany . 5,333 parts In-Stock

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5,333

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Continental Prestige Electronics

USA . 3,031 parts In-Stock

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3,031

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Argo Parts USA

USA . 2,441 parts In-Stock

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2,441

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Parana Technologies

USA . 1,281 parts In-Stock

1+ parts

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$15.001

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1,281

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$15.001

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Corphita

USA . 995 parts In-Stock

1+ parts

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995

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Kepictronics

USA . 394 parts In-Stock

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394

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Bastille Electronics

Australia . 200 parts In-Stock

1+ parts

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200

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Overview

Elevate your designs with the VN808CM by STMicroelectronics, a top-tier manufacturer known for its cutting-edge technology and superior quality. As a versatile peripheral driver, this product offers unmatched reliability and performance in a wide range of applications. Experience the value of built-in protections against transient events, over-current situations, thermal issues, and under-voltage conditions. With a maximum supply voltage of 45V and a nominal supply voltage of 24V, this compact driver boasts 8 functions and a dual terminal position for seamless integration. Upgrade your projects today with the VN808CM and unleash the true potential of your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the peripheral driver.

Maximum Supply Voltage: 45 V

With a high maximum supply voltage of 45V, this peripheral driver is suitable for use in various applications without the risk of voltage overload.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

The multiple built-in protections such as transient, over current, thermal, and under voltage ensure the safety and reliability of the connected devices.

Peak Reflow Temperature °C: 245

The high peak reflow temperature of 245°C allows for a reliable soldering process during assembly, ensuring strong connections and long-term performance.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter based interface IC type provides versatility in connecting and controlling peripheral devices, making this driver compatible with a wide range of components.

Technical Specifications

Peripheral Drivers VN808CM attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

8

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

8

No. of Terminals:

36

Output Current Flow Direction:

SOURCE

Maximum Output Current:

.012 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

10.5/32

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

45 V

Minimum Supply Voltage:

10.5 V

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Turn-off Time:

150 us

Turn-on Time:

100 us

Width:

11 mm

Trade Compliance

VN808CM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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