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VN5012AK-E

STMicroelectronics

VN5012AK-E by STMicroelectronics

VN5012AK-E by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent and thermal issues. It features a compact 24-terminal design, ideal for space-constrained applications. This CMOS device operates efficiently b/w 4.5V to 36V, making it suitable for various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,862 parts In-Stock

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5,862

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Chip Stock

USA . 3,400 parts In-Stock

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3,400

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Anansix

USA . 2,876 parts In-Stock

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2,876

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Bristol Electronics

USA . 475 parts In-Stock

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475

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Dan-Mar Components

USA . 475 parts In-Stock

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475

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Digiode

USA . 316 parts In-Stock

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316

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,190 parts In-Stock

1+ parts

$11.682

100+ parts

-

1k+ parts

$10.514

10k+ parts

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2,190

$11.682

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$10.514

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Microchip USA

USA . 439 parts In-Stock

1+ parts

$16.005

100+ parts

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439

$16.005

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AZTECH Wire

Italy . 775 parts In-Stock

1+ parts

$16.970

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775

$16.970

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MKK Technologies

India . 1,991 parts In-Stock

1+ parts

$21.968

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1,991

$21.968

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DigiPath Technology Company

USA . 1,991 parts In-Stock

1+ parts

$21.968

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1,991

$21.968

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Corphita

USA . 4,714 parts In-Stock

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4,714

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Parana Technologies

USA . 1,938 parts In-Stock

1+ parts

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$13.968

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1,938

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$13.968

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Perfect Parts

USA . 988 parts In-Stock

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988

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Elevate your designs with the VN5012AK-E from STMicroelectronics, a powerful peripheral driver that combines cutting-edge technology with robust protection features. Known for their commitment to quality and innovation, STMicroelectronics ensures reliability and efficiency in every component. Perfect for automotive and industrial applications, this driver enhances system performance while safeguarding against voltage fluctuations. Trust in STMicroelectronics for superior solutions that empower your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for a compact design and better integration into modern circuit boards.

Maximum Supply Voltage: 36 V

A high maximum supply voltage provides flexibility in design, accommodating a variety of application requirements.

No. of Functions: 2

With two functions, this peripheral driver can effectively handle multiple tasks, enhancing its versatility.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, promoting easier layout and design.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections ensure the driver operates safely, reducing the risk of damage from unforeseen electrical conditions.

Power Supplies (V): 8/36

This wide range of power supply voltages increases compatibility with various systems, enhancing its application potential.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options, allowing for complex circuit designs and robust performance.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline, shrink pitch design minimizes PCB space usage while maintaining high performance.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage expands usability in low-power applications, making it energy-efficient.

Terminal Position: DUAL

The dual terminal position optimizes layout flexibility on the PCB, promoting better design integration.

Maximum Seated Height: 2.22 mm

A low seated height profile supports high-density designs, making it suitable for space-constrained applications.

Width: 7.5 mm

The controlled width ensures compatibility with standard designs while allowing for efficient use of PCB area.

Length: 10.3 mm

The length is optimized for fitting in a variety of circuit board layouts while maintaining performance.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making it ideal for modern applications.

Terminal Form: GULL WING

Gull wing terminals enhance soldering performance and reliability, ensuring stable electrical connections.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V is well-suited for various applications, striking a balance between performance and power consumption.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch facilitates compact designs while still enabling reliable soldering, ideal for high-density layouts.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This type interface allows for versatility in controlling signal flows, making it suitable for a range of applications.

Output Current Flow Direction: SOURCE

As a source output current flow, it is capable of driving loads directly, simplifying circuit design.

Technical Specifications

Peripheral Drivers VN5012AK-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G24

Length:

10.3 mm

No. of Functions:

2

No. of Terminals:

24

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.22 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

VN5012AK-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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