Loading...

VN5010AKTR-E

STMicroelectronics

VN5010AKTR-E by STMicroelectronics

VN5010AKTR-E by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V, supporting up to 65A output current. It features built-in protections against overcurrent and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,883 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,883

-

-

-

-

Chip Stock

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

Digiode

USA . 2,786 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,786

-

-

-

-

Anansix

USA . 2,183 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,183

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 740 parts In-Stock

1+ parts

$11.730

100+ parts

-

1k+ parts

-

10k+ parts

-

740

$11.730

-

-

-

IDEA Electronic Components Group

UK . 1,454 parts In-Stock

1+ parts

$13.553

100+ parts

-

1k+ parts

$12.198

10k+ parts

-

1,454

$13.553

-

$12.198

-

MKK Technologies

India . 1,892 parts In-Stock

1+ parts

$25.486

100+ parts

-

1k+ parts

-

10k+ parts

-

1,892

$25.486

-

-

-

DigiPath Technology Company

USA . 1,892 parts In-Stock

1+ parts

$25.486

100+ parts

-

1k+ parts

-

10k+ parts

-

1,892

$25.486

-

-

-

Ampacity Inc.

Singapore . 150 parts In-Stock

1+ parts

$47.500

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$47.500

-

-

-

Microchip USA

USA . 459 parts In-Stock

1+ parts

$55.311

100+ parts

-

1k+ parts

-

10k+ parts

-

459

$55.311

-

-

-

Perfect Parts

USA . 6,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,720

-

-

-

-

Kepictronics

USA . 3,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,080

-

-

-

-

Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,690 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,690

-

-

-

-

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Corphita

USA . 2,187 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,187

-

-

-

-

Parana Technologies

USA . 886 parts In-Stock

1+ parts

-

100+ parts

$16.205

1k+ parts

-

10k+ parts

-

886

-

$16.205

-

-

Overview

Experience unparalleled reliability with the VN5010AKTR-E from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for robust peripheral driving applications, this compact, surface-mount device offers built-in protections against transients, overcurrent, and thermal events, ensuring longevity and peace of mind. Elevate your projects with this dependable driver that seamlessly integrates into diverse systems, delivering outstanding performance and value across automotive and industrial sectors. Choose STMicroelectronics for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials enhances durability and thermal stability, making this peripheral driver suitable for various environments.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern electronic devices, increasing versatility in applications.

Maximum Supply Voltage: 36 V

A high maximum supply voltage provides flexibility in applications, allowing compatibility with a wide range of power sources.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on printed circuit boards, enabling efficient layout designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Integrated protections ensure the device operates safely in diverse conditions, enhancing reliability and reducing system failure risks.

Power Supplies (V): 8/36

Supports multiple supply voltages, offering adaptability for different systems and reducing the need for multiple driver types.

No. of Terminals: 24

A 24-terminal configuration supports complex connections and functionality, making it ideal for advanced peripheral applications.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline package with heat sink integration enables efficient thermal management, essential for high-performance applications.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage allows operation in battery-powered devices, enhancing energy efficiency and extending battery life.

Terminal Finish: MATTE TIN

Matte tin terminal finish improves solderability and enhances the reliability of connections, which is crucial for long-term performance.

Terminal Position: DUAL

Dual terminal positioning simplifies layout design and enhances connectivity options in PCB designs.

Maximum Seated Height: 2.47 mm

A low profile means space-saving on circuit boards, making this driver perfect for compact designs.

Width: 7.5 mm

A narrow width allows for efficient use of space on PCBs and facilitates the design of more compact electronic solutions.

Peak Reflow Temperature °C: 260

A high peak reflow temperature ensures reliability during soldering processes, supporting various manufacturing techniques.

Length: 10.3 mm

Shorter lengths enable compact designs, which is vital for today's miniaturized electronic devices.

Maximum Output Current: 0.003 A

While the output current is modest, it is suitable for many peripheral applications, ensuring efficient power use.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, making this driver a smart choice for energy-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and ease of assembly, particularly advantageous in high-volume production.

Nominal Supply Voltage: 13 V

A nominal supply voltage close to the middle of the operational range allows for balanced performance in many applications.

Turn-on Time: 35 us

Fast turn-on time enables quick response to control signals, important for high-speed applications.

Terminal Pitch: 0.8 mm

A compact terminal pitch supports dense layouts and smaller designs, which is ideal for advanced electronics.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates reasonable sensitivity to moisture, which can inform storage and handling practices, ensuring product integrity.

Nominal Output Peak Current Limit: 65 A

High peak current capability allows the driver to handle demanding loads, making it versatile for a range of applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

As a buffer or inverter based driver, this product is suitable for diverse interfacing requirements in various digital systems.

Turn-off Time: 65 us

Fast turn-off time ensures that the peripheral device responds promptly to control signals, aiding in overall system efficiency.

Output Current Flow Direction: SINK

The sink output current direction allows for effective control of output devices, making it suitable for a variety of applications.

Technical Specifications

Peripheral Drivers VN5010AKTR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Output Current Flow Direction:

SINK

Maximum Output Current:

.003 A

Nominal Output Peak Current Limit:

65 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.47 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Turn-off Time:

65 us

Turn-on Time:

35 us

Width:

7.5 mm

Trade Compliance

VN5010AKTR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 11