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VN05NSP13TR

STMicroelectronics

VN05NSP13TR by STMicroelectronics

VN05NSP13TR by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 26V and built-in protections against overcurrent, thermal issues, and transients. It features a compact design with 10 terminals in a small outline package. Ideal for applications requiring reliable output current control up to 1.4A.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,299 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,299

-

-

-

-

Digiode

USA . 1,934 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,934

-

-

-

-

Vyrian

USA . 1,380 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,380

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 129 parts In-Stock

1+ parts

$2.658

100+ parts

-

1k+ parts

$2.392

10k+ parts

-

129

$2.658

-

$2.392

-

MKK Technologies

India . 1,136 parts In-Stock

1+ parts

$4.998

100+ parts

-

1k+ parts

-

10k+ parts

-

1,136

$4.998

-

-

-

DigiPath Technology Company

USA . 1,136 parts In-Stock

1+ parts

$4.998

100+ parts

-

1k+ parts

-

10k+ parts

-

1,136

$4.998

-

-

-

Corphita

USA . 3,563 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,563

-

-

-

-

Parana Technologies

USA . 1,379 parts In-Stock

1+ parts

-

100+ parts

$3.178

1k+ parts

-

10k+ parts

-

1,379

-

$3.178

-

-

Overview

Experience unparalleled reliability with the VN05NSP13TR from STMicroelectronics, a trusted leader in innovative solutions. Tailored for superior performance in peripheral driver applications, this compact device boasts robust built-in protections against transients, overcurrent, and thermal issues, ensuring your designs remain safe and efficient. Elevate your projects with exceptional quality and peace of mind, knowing you’re backed by industry expertise and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact PCB designs and automated assembly processes, enhancing manufacturing efficiency.

Maximum Supply Voltage: 26 V

A maximum supply voltage of 26 V ensures compatibility with a wide range of power supply configurations, making it versatile for various applications.

Package Shape: RECTANGULAR

The rectangular shape of the package optimizes space on the PCB, providing a neat and organized layout.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

These built-in protection features enhance reliability and safety by preventing damage from electrical anomalies.

No. of Terminals: 10

The 10 terminals allow for versatile connection options for various circuits, enhancing application flexibility.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

This package style supports effective heat dissipation, preventing overheating during operation.

Minimum Supply Voltage: 7 V

A minimum supply voltage of 7 V allows the product to operate effectively in low voltage applications.

Terminal Position: DUAL

The dual terminal position facilitates easier layout design and improves soldering efficiency.

Maximum Seated Height: 3.75 mm

The low seated height allows for thinner PCB designs, which is ideal for compact electronics.

Width: 7.5 mm

A width of 7.5 mm strikes a balance between compact size and the space needed for proper heat dissipation.

Length: 9.4 mm

The overall length contributes to the product's space-saving design, making it suitable for tight layouts.

Terminal Form: GULL WING

Gull wing terminals provide superior mechanical strength and easier soldering, enhancing manufacturing reliability.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13 V is optimal for a variety of applications, ensuring efficient operation.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for compatibility with standard PCB assembly processes, streamlining production.

Nominal Output Peak Current Limit: 1.4 A

The high peak current limit supports power-hungry peripherals, making the product capable of handling demanding tasks.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This interface type indicates versatility in application, catering to a range of buffering or signal inversion needs.

Output Current Flow Direction: SINK

The sink current flow direction simplifies circuit design, allowing for more straightforward integration into various systems.

Technical Specifications

Peripheral Drivers VN05NSP13TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G10

Length:

9.4 mm

No. of Functions:

1

No. of Terminals:

10

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

1.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Maximum Supply Voltage:

26 V

Minimum Supply Voltage:

7 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

VN05NSP13TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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