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VN05H(012Y)

STMicroelectronics

VN05H(012Y) by STMicroelectronics

VN05H(012Y) by STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V and an output current of 6A. It features built-in protections against transient, overcurrent, and thermal issues. Ideal for applications requiring reliable power management in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,036 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,036

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-

-

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Digiode

USA . 710 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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710

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-

-

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Anansix

USA . 255 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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255

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,090 parts In-Stock

1+ parts

$3.578

100+ parts

-

1k+ parts

$3.220

10k+ parts

-

1,090

$3.578

-

$3.220

-

MKK Technologies

India . 687 parts In-Stock

1+ parts

$6.728

100+ parts

-

1k+ parts

-

10k+ parts

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687

$6.728

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DigiPath Technology Company

USA . 687 parts In-Stock

1+ parts

$6.728

100+ parts

-

1k+ parts

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10k+ parts

-

687

$6.728

-

-

-

Corphita

USA . 2,615 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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2,615

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Parana Technologies

USA . 1,748 parts In-Stock

1+ parts

-

100+ parts

$4.278

1k+ parts

-

10k+ parts

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1,748

-

$4.278

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Overview

Elevate your designs with the VN05H(012Y) from STMicroelectronics, a leading name in semiconductor excellence. This robust peripheral driver ensures reliable performance across various applications, from automotive to industrial automation. With built-in protections against transients and overcurrent, it enhances durability while simplifying your design process. Experience peace of mind and exceptional value as you harness the power of advanced technology to drive innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making the product ideal for long-term usage.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage, this peripheral driver can handle a variety of applications, providing flexibility in design.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient space utilization on PCBs, allowing for more compact designs.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Built-in protections enhance safety and reliability, preventing potential damage from electrical issues during operation.

Power Supplies (V): 13

A standard operating voltage of 13V allows compatibility with many existing systems and simplifies integration.

No. of Terminals: 5

Having five terminals provides sufficient connection points for enhanced functionality without overcrowding the PCB.

Package Style (Meter): FLANGE MOUNT

The flange mount style facilitates secure mechanical attachment, ensuring stable performance in various applications.

Minimum Supply Voltage: 5.5 V

A minimum supply voltage of 5.5V ensures that the device can operate in lower voltage environments, increasing versatility.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead finish provides good solderability and conductivity, ensuring reliable electrical connections.

Terminal Position: SINGLE

Single terminal positions help in simplifying the layout design, making it easier for integration on PCBs.

Maximum Output Current: 6 A

The capability to output 6 A makes this driver suitable for powering various peripherals effectively.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer robust mechanical strength and are ideal for high-power applications.

Nominal Supply Voltage: 13 V

With a nominal supply voltage of 13V, this peripheral driver is well-suited for consistent and stable operation.

Terminal Pitch: 1.7 mm

A terminal pitch of 1.7 mm helps in compact designs while maintaining sufficient spacing for soldering.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer or inverter based peripheral driver allows this product to effectively manage signal integrity and drive capabilities.

Output Current Flow Direction: SOURCE

The sourcing output current direction empowers the driver to effectively power connected peripherals, enhancing system performance.

Technical Specifications

Peripheral Drivers VN05H(012Y) attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PSFM-T5

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

5

Output Current Flow Direction:

SOURCE

Maximum Output Current:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP5,.1,67TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

13

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Trade Compliance

VN05H(012Y) Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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