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VN05HSP

STMicroelectronics

VN05HSP by STMicroelectronics

STMicroelectronics' VN05HSP is a 10-terminal peripheral driver with max supply voltage of 36V and output current of 6A. It features built-in protections for overcurrent, thermal, and undervoltage. Ideal for applications requiring source flow direction and nominal voltage of 13V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,587 parts In-Stock

1+ parts

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4,587

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Anansix

USA . 380 parts In-Stock

1+ parts

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-

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380

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Digiode

USA . 349 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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349

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Component Electronics Inc.

Canada . 7 parts In-Stock

1+ parts

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7

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 900 parts In-Stock

1+ parts

$9.953

100+ parts

-

1k+ parts

$8.957

10k+ parts

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900

$9.953

-

$8.957

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MKK Technologies

India . 733 parts In-Stock

1+ parts

$18.715

100+ parts

-

1k+ parts

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733

$18.715

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DigiPath Technology Company

USA . 733 parts In-Stock

1+ parts

$18.715

100+ parts

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733

$18.715

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Corphita

USA . 3,705 parts In-Stock

1+ parts

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3,705

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Parana Technologies

USA . 2,276 parts In-Stock

1+ parts

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100+ parts

$11.900

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2,276

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$11.900

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Overview

Unleash the power of your electronics with the VN05HSP by STMicroelectronics. This top-tier peripheral driver offers unmatched quality and reliability, backed by a renowned manufacturer in the industry. Ideal for a wide range of applications, this product provides over current, thermal, and under voltage protections to ensure optimal performance. Experience seamless integration and enhanced efficiency with the VN05HSP - your go-to solution for all your driving needs. Elevate your projects with this high-value, high-performance component today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness.

Surface Mount: YES

Facilitates easy installation and integration into circuit boards.

Maximum Supply Voltage: 36 V

Can handle high voltage inputs, making it versatile for a range of applications.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

Ensures the safety and longevity of the product by protecting it from common issues that can arise.

Power Supplies (V): 13

Provides a stable power source for the peripheral driver to operate efficiently.

No. of Terminals: 10

Offers ample connectivity options for various components in a circuit.

Package Style (Meter): SMALL OUTLINE

Compact design allows for space-saving installation in tight spaces.

Minimum Supply Voltage: 5.5 V

Can operate effectively even with a relatively low supply voltage.

Terminal Finish: MATTE TIN

Provides good conductivity and corrosion resistance.

Terminal Position: DUAL

Allows for flexibility in connecting the peripheral driver within a circuit.

Maximum Seated Height: 3.75 mm

Low profile design aids in compact installations.

Width: 7.5 mm

Small width allows for easy placement on a circuit board.

Length: 9.4 mm

Optimal length for accommodating the required terminals and components.

Maximum Output Current: 6 A

Capable of supplying a significant amount of current to connected components.

Terminal Form: GULL WING

Facilitates easy soldering onto circuit boards.

Nominal Supply Voltage: 13 V

Standard supply voltage for stable operation.

Terminal Pitch: 1.27 mm

Standard pitch for easy integration into circuits.

Nominal Output Peak Current Limit: 1.4 A

Limits peak output current to protect connected devices.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Flexible interface options for different circuit requirements.

Output Current Flow Direction: SOURCE

Consistent output current flow direction for predictable circuit behavior.

Technical Specifications

Peripheral Drivers VN05HSP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

No. of Functions:

1

No. of Terminals:

10

Output Current Flow Direction:

SOURCE

Maximum Output Current:

6 A

Nominal Output Peak Current Limit:

1.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

13

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

VN05HSP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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