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UPSD3454EVB40U6

STMicroelectronics

UPSD3454EVB40U6 by STMicroelectronics

UPSD3454EVB40U6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates at up to 40 MHz. It features 46 I/O lines, ADC channels, and is ideal for industrial applications due to its wide temp range (-40 °C to 85 °C).

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,250 parts In-Stock

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5,250

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Anansix

USA . 2,696 parts In-Stock

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2,696

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Digiode

USA . 1,883 parts In-Stock

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1,883

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EMSNET

USA . 18 parts In-Stock

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Goldney Electronics S.L.

Spain . 2 parts In-Stock

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Inventory MP

USA . 1 parts In-Stock

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Bristol Electronics

USA . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 412 parts In-Stock

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$17.660

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412

$17.660

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Microchip USA

USA . 169 parts In-Stock

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$21.941

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169

$21.941

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IDEA Electronic Components Group

UK . 1,599 parts In-Stock

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$42.694

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$38.425

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1,599

$42.694

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$38.425

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MKK Technologies

India . 12 parts In-Stock

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$80.284

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12

$80.284

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DigiPath Technology Company

USA . 12 parts In-Stock

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$80.284

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12

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Vigor

Singapore . 1,563 parts In-Stock

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Parana Technologies

USA . 1,150 parts In-Stock

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$51.048

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Corphita

USA . 525 parts In-Stock

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Overview

Unlock the potential of your projects with the UPSD3454EVB40U6 from STMicroelectronics! This versatile microcontroller combines exceptional quality and reliability, making it the ideal choice for industrial applications. With a robust performance range and advanced features, it empowers developers to create innovative solutions while ensuring energy efficiency. Trust in STMicroelectronics' legacy of excellence and elevate your designs to new heights with this high-performance component!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Being surface mount allows for efficient use of PCB space, enabling compact designs that are essential for modern electronics.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6V accommodates a variety of low-voltage applications, enhancing device reliability and energy efficiency.

Address Bus Width: 16

A 16-bit address bus width allows for addressing a larger memory range, making it suitable for applications requiring substantial data handling.

Package Shape: SQUARE

The square package shape contributes to uniformity in layout design, facilitating easier mounting and thermal management.

Bit Size: 8

An 8-bit architecture supports a balance of simplicity and performance, making it ideal for a wide range of embedded applications.

Power Supplies (V): 3.3

Operating at 3.3V reduces power consumption, making it ideal for battery-operated devices and energy-efficient applications.

No. of Terminals: 80

With 80 terminals, this microcontroller provides flexibility for I/O connections, enabling the interfacing with a variety of sensors and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile and fine pitch design is excellent for applications requiring compact circuits and high-density layouts.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3V ensures reliable operation under varying power conditions, increasing the robustness of the design.

Maximum Operating Temperature: 85 °C

The capability to operate at temperatures up to 85 °C makes it suitable for harsh industrial environments.

CPU Family: 8051

Based on the 8051 family, it benefits from a well-established architecture known for its simplicity and wide software support.

Minimum Operating Temperature: -40 °C

The temperature range down to -40 °C allows for operation in extreme conditions, making it versatile for various applications.

Terminal Finish: MATTE TIN

Matte tin finishing enhances solderability and reduces the risk of oxidation, providing a reliable connection.

ADC Channels: YES

Inclusion of ADC channels allows for direct interfacing with analog sensors, maximizing the microcontroller's utility in sensor applications.

Terminal Position: QUAD

Quad terminal position aids in providing better connectivity options and flexibility for PCB designs.

ROM Words: 262144

With 262,144 ROM words, ample memory is available for storing firmware and application code, allowing complex functionalities.

Maximum Seated Height: 1.6 mm

A low seated height ensures versatility in various applications and minimizes space consumption on the PCB.

Width: 12 mm

A compact width of 12 mm facilitates integration into space-constrained designs without compromising performance.

External Data Bus Width: 8

An 8-bit external data bus supports efficient data transfer, making it suitable for applications that require timely processing.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz allows for high-speed operation, enabling complex processing tasks in real time.

Length: 12 mm

The 12 mm length complements the compact design, facilitating ease in building efficient electronic systems.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures ensures reliability and longevity in demanding applications.

Peripheral IC Type: MICROCONTROLLER

The microcontroller type indicates integrated functionalities that streamline system designs, reducing overall component count.

RAM Bytes: 32768

With 32,768 bytes of RAM, it supports sufficient data handling for various tasks, making it suitable for complex applications.

Technology: CMOS

CMOS technology contributes to lower power consumption and higher performance, making it ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals simplify PCB assembly and soldering processes, improving manufacturing efficiency.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3V optimizes power efficiency while ensuring stable operation across various conditions.

PWM Channels: YES

Having PWM channels enables precise control in applications like motor driving and LED dimming, enhancing its versatility.

ROM Programmability: FLASH

The flash programmability allows for easy firmware updates and customization, providing adaptability to evolving application needs.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm allows for compact designs and high-density PCB layouts, advancing modern electronic design capabilities.

Speed: 40 rpm

With a speed rating of 40 rpm, this microcontroller can serve efficiently in applications requiring timely responses and operations.

No. of I/O Lines: 46

Having 46 I/O lines provides versatility for a multitude of interfacing options with sensors, actuators, and other peripherals.

Technical Specifications

Microcontrollers UPSD3454EVB40U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

46

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Trade Compliance

UPSD3454EVB40U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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