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UPSD3434EB40U6

STMicroelectronics

UPSD3434EB40U6 by STMicroelectronics

UPSD3434EB40U6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates at up to 40 MHz. It features 262,144 ROM words and supports ADC/PWM channels, making it ideal for industrial applications. Its compact design ensures efficient performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,909 parts In-Stock

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3,909

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Anansix

USA . 1,567 parts In-Stock

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1,567

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Digiode

USA . 732 parts In-Stock

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732

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Distributors (Availability)

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Microchip USA

USA . 293 parts In-Stock

1+ parts

$7.246

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293

$7.246

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AZTECH Wire

Italy . 652 parts In-Stock

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$20.320

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652

$20.320

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IDEA Electronic Components Group

UK . 1,523 parts In-Stock

1+ parts

$79.407

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$71.466

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1,523

$79.407

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$71.466

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Component Stockers USA

USA . 561 parts In-Stock

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$99.990

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561

$99.990

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MKK Technologies

India . 2,009 parts In-Stock

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$149.320

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2,009

$149.320

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DigiPath Technology Company

USA . 2,009 parts In-Stock

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$149.320

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2,009

$149.320

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Corphita

USA . 4,250 parts In-Stock

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4,250

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Vigor

Singapore . 1,535 parts In-Stock

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1,535

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Parana Technologies

USA . 194 parts In-Stock

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$94.943

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194

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$94.943

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Overview

Elevate your project with the UPSD3434EB40U6 from STMicroelectronics, a trusted leader in microcontroller technology. This versatile and robust 8-bit microcontroller is designed for high-performance applications, offering reliability from -40 °C to 85 °C. With integrated ADC and PWM capabilities, it empowers innovative designs across industries like automotive, industrial automation, and consumer electronics. Choose STMicroelectronics for quality you can count on, enhancing both functionality and efficiency in your next endeavor!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers durability and resistance to environmental factors, ensuring long-term reliability of the microcontroller.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, making this microcontroller suitable for modern electronics.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller is versatile for various power supply configurations.

Address Bus Width: 16

A 16-bit address bus enables addressing a larger memory space, improving capability for complex applications.

Package Shape: SQUARE

The square package shape optimizes layout design and thermal management on PCBs.

Bit Size: 8

Being an 8-bit microcontroller makes it suitable for a wide range of simple to moderately complex tasks.

Power Supplies (V): 3.3, 5

Supports multiple supply voltages (3.3 V and 5 V), enhancing flexibility in design and application.

No. of Terminals: 80

The availability of 80 terminals offers extensive connectivity options for peripherals and external devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile and fine pitch design are ideal for space-constrained applications, allowing for compact board layouts.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures stable operation in various conditions.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C indicates the suitability of the microcontroller for industrial applications.

CPU Family: 8051

The 8051 family is widely used and supported, providing a wealth of resources and community support for development.

Minimum Operating Temperature: -40 °C

Withstanding extreme cold temperatures down to -40 °C makes this microcontroller suitable for harsh environments.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and provides protection against corrosion.

ADC Channels: YES

Integrated ADC channels enable direct analog signal processing, which is highly beneficial for sensor applications.

Terminal Position: QUAD

Quad terminal positioning allows for flexible mounting options and improved PCB layout.

ROM Words: 262144

With 262,144 ROM words, this microcontroller provides ample space for program storage and complex applications.

Maximum Seated Height: 1.6 mm

Low seated height contributes to a compact design, making it ideal for applications with limited space.

Width: 12 mm

A standard width of 12 mm facilitates easy integration into various designs and standardizes mounting.

External Data Bus Width: 8

An 8-bit external data bus helps in efficient communication with peripheral devices, maintaining good performance.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz provides high performance for real-time processing tasks.

Length: 12 mm

A length of 12 mm keeps the component compact and easy to fit into smaller device designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and performance in demanding applications.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, it integrates control, I/O, and processing functions in one device.

RAM Bytes: 8192

With 8,192 bytes of RAM, it provides sufficient memory for variable storage and data manipulation during operations.

Technology: CMOS

Built with CMOS technology, it offers low power consumption and high-speed performance, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing leads provide excellent soldering characteristics and are standard in many PCB assembly processes.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V ensures compatibility with many existing systems and power supplies.

PWM Channels: YES

Integrated PWM channels allow for effective motor control, making it suitable for robotics and automation applications.

ROM Programmability: FLASH

With FLASH ROM programmability, users can easily update and modify firmware as needed without requiring a physical change.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch facilitates high-density PCB designs and ensures reliable connections.

Speed: 40 rpm

With a speed capability of 40 rpm, this microcontroller can manage real-time processing requirements efficiently.

No. of I/O Lines: 46

Having 46 I/O lines allows for extensive interfacing capabilities with other devices, enhancing versatility in application development.

Technical Specifications

Microcontrollers UPSD3434EB40U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

46

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Trade Compliance

UPSD3434EB40U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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