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UPSD3433E-40U6

STMicroelectronics

UPSD3433E-40U6 by STMicroelectronics

UPSD3433E-40U6 from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates at up to 40 MHz. It features 131072 ROM words, 8192 RAM bytes, and supports ADC/PWM channels. Ideal for industrial applications requiring robust performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,751 parts In-Stock

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7,751

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Anansix

USA . 1,897 parts In-Stock

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1,897

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Digiode

USA . 1,655 parts In-Stock

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1,655

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Distributors (Availability)

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AZTECH Wire

Italy . 569 parts In-Stock

1+ parts

$8.610

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-

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569

$8.610

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Microchip USA

USA . 344 parts In-Stock

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$18.886

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344

$18.886

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IDEA Electronic Components Group

UK . 1,282 parts In-Stock

1+ parts

$41.376

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$37.238

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1,282

$41.376

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$37.238

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MKK Technologies

India . 555 parts In-Stock

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$77.805

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555

$77.805

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DigiPath Technology Company

USA . 555 parts In-Stock

1+ parts

$77.805

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555

$77.805

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Corphita

USA . 3,049 parts In-Stock

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3,049

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Vigor

Singapore . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 1,358 parts In-Stock

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$49.471

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1,358

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$49.471

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Speed Components Ltd (Excess)

Israel . 19 parts In-Stock

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Overview

Elevate your designs with the UPSD3433E-40U6 from STMicroelectronics—where quality meets innovation. This versatile microcontroller delivers reliability for a wide range of applications, from industrial automation to consumer electronics. Its robust performance in extreme temperatures ensures longevity and minimizes downtime, while the compact design allows for seamless integration into your projects. Choose STMicroelectronics for superior technology and unmatched customer support, transforming your ideas into reality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides a durable and cost-effective solution for protecting the microcontroller from environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient PCB lay-out, making the microcontroller suitable for space-constrained applications.

Maximum Supply Voltage: 5.5 V

The ability to operate at a maximum supply voltage of 5.5 V provides flexibility in power supply options, allowing integration into various systems.

Address Bus Width: 16

A 16-bit address bus widens the memory access capabilities, enabling the microcontroller to address larger memory sizes efficiently.

Package Shape: SQUARE

The square package facilitates uniform mounting and easy handling during assembly, which enhances manufacturing efficiency.

Bit Size: 8

With an 8-bit architecture, this microcontroller is capable of performing basic tasks and controlling simpler applications effectively.

Power Supplies (V): 3.3, 5

The option to use both 3.3V and 5V supply voltages makes this microcontroller versatile and compatible with a wide range of components.

No. of Terminals: 80

Having 80 terminals allows for a greater number of input/output connections, facilitating complex interfacing and connectivity in designs.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack design promotes space saving on PCBs while also allowing for fine-pitch connections that are favorable in high-density applications.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures stable operation in various application scenarios where voltage levels may fluctuate.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature enables the microcontroller to be used in harsh environments without compromising performance.

CPU Family: 8051

Based on the proven 8051 architecture, this microcontroller benefits from a large ecosystem of development resources and community support.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C ensures reliable operation in extreme environments, making this microcontroller suitable for industrial applications.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections within the device.

ADC Channels: YES

Integrated ADC channels allow for direct analog sensing, streamlining designs and reducing the need for additional components.

Terminal Position: QUAD

Quad terminal positioning ensures effective heat dissipation and better mechanical stability during operation.

ROM Words: 131072

A ROM capacity of 131072 words provides ample space for code storage, allowing for complex applications and functionality.

Maximum Seated Height: 1.6 mm

The low seated height is ideal for applications where height constraints are critical, allowing for more compact designs.

Width: 12 mm

With a width of 12 mm, the microcontroller fits well in various PCB layouts and maintains a compact overall design.

External Data Bus Width: 8

An 8-bit external data bus enhances the microcontroller's ability to process data efficiently, making it a competent choice for basic data handling.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz supports high-speed processing, making this microcontroller suitable for performance-demanding applications.

Length: 12 mm

The compact 12 mm length allows for easy integration into various devices, adhering to size-sensitive design requirements.

Temperature Grade: INDUSTRIAL

Rated for industrial temperatures, this microcontroller is designed for reliability in challenging applications, increasing its longevity.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller makes this product versatile for a wide array of applications, from simple tasks to complex embedded systems.

RAM Bytes: 8192

With 8192 bytes of RAM, the microcontroller can support more complex computations and maintain multiple tasks efficiently.

Technology: CMOS

The CMOS technology used in this microcontroller contributes to low power consumption, making it suitable for energy-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals allow for easy visual inspection and provide good soldering characteristics during assembly.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is standard for many applications, enabling easy integration with existing systems.

PWM Channels: YES

The inclusion of PWM channels allows for motor control and dimming applications, making this microcontroller versatile.

ROM Programmability: FLASH

Flash ROM programmability enables easy updates and modifications to the firmware, improving the flexibility and lifespan of the products using this microcontroller.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch is optimal for high-density applications, allowing for more connections in a smaller footprint.

Speed: 40 rpm

The ability to control systems at 40 rpm makes this microcontroller suitable for various applications that require precise motion control.

No. of I/O Lines: 46

Having 46 I/O lines offers great flexibility in interfacing with sensors, actuators, and other peripherals, accommodating complex designs.

Technical Specifications

Microcontrollers UPSD3433E-40U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

No. of I/O Lines:

46

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Trade Compliance

UPSD3433E-40U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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