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UPSD3354D-40U6

STMicroelectronics

UPSD3354D-40U6 by STMicroelectronics

UPSD3354D-40U6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates at up to 40 MHz. It features 46 I/O lines, supports ADC and PWM channels, making it ideal for industrial applications requiring robust performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,601 parts In-Stock

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8,601

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Digiode

USA . 3,679 parts In-Stock

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3,679

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Anansix

USA . 616 parts In-Stock

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616

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Chip Stock

USA . 181 parts In-Stock

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181

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Distributors (Availability)

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AZTECH Wire

Italy . 108 parts In-Stock

1+ parts

$9.370

100+ parts

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108

$9.370

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IDEA Electronic Components Group

UK . 1,940 parts In-Stock

1+ parts

$38.661

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-

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$34.795

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1,940

$38.661

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$34.795

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MKK Technologies

India . 1,510 parts In-Stock

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$72.700

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1,510

$72.700

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DigiPath Technology Company

USA . 1,510 parts In-Stock

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$72.700

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1,510

$72.700

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Microchip USA

USA . 397 parts In-Stock

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$77.296

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397

$77.296

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Perfect Parts

USA . 2,638 parts In-Stock

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2,638

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Vigor

Singapore . 2,107 parts In-Stock

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2,107

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Corphita

USA . 1,646 parts In-Stock

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1,646

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Kepictronics

USA . 416 parts In-Stock

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416

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Parana Technologies

USA . 331 parts In-Stock

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$46.225

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331

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$46.225

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Overview

Elevate your projects with the UPSD3354D-40U6 microcontroller from STMicroelectronics, a trusted leader in cutting-edge technology. Designed for versatility and reliability, this compact powerhouse excels in industrial applications, offering robust performance under extreme temperatures. With features like advanced ADC channels and programmable ROM, it ensures seamless integration and efficiency, delivering exceptional value that accelerates innovation while meeting your critical demands.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures the microcontroller is resistant to environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

The surface mount design allows for efficient use of PCB space and enables automated assembly, thus reducing manufacturing costs.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V offers flexibility in power supply options while ensuring stable operation within safe limits.

Address Bus Width: 12

With a 12-bit address bus, the microcontroller can address a larger memory space, allowing for more complex applications.

Package Shape: SQUARE

The square package shape can ease layout and integration in compact designs.

Bit Size: 8

An 8-bit architecture is suitable for applications requiring moderate processing capability and efficient data handling.

Power Supplies (V): 3.3, 5

Compatibility with both 3.3V and 5V power supplies adds versatility for different system requirements.

No. of Terminals: 80

The 80 terminals provide ample I/O options, enabling connection to a wide range of peripherals and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile package style is advantageous for space-constrained applications and high-density PCB layouts.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures reliable operation with common power sources in embedded applications.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C makes this microcontroller suitable for industrial environments where higher temperatures may occur.

CPU Family: 8051

The 8051 CPU family offers a robust set of instructions and a wide developer community, ensuring extensive support and resources.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C allows use in harsh environments, ensuring reliability in extreme conditions.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

This high-quality terminal finish ensures excellent solderability and durability, which is crucial for long-term reliability.

ADC Channels: YES

The inclusion of ADC channels makes the microcontroller ideal for applications requiring analog signal processing.

Terminal Position: QUAD

Quad terminal positioning enhances connectivity and simplifies PCB design for complex circuits.

ROM Words: 262144

With 262144 ROM words available, this microcontroller can store a substantial amount of firmware, making it suitable for sophisticated applications.

Maximum Seated Height: 1.6 mm

A low seated height facilitates placement in compact assemblies, important for space-limited applications.

Width: 12 mm

At a width of 12 mm, it provides a balance between size and connectivity, fitting well in various designs.

External Data Bus Width: 8

An 8-bit external data bus width enables efficient data transfer, which is critical for performance in multitasking environments.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz ensures the microcontroller can handle demanding computational tasks effectively.

Length: 12 mm

The compact length of 12 mm allows for easy integration into space-constrained designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this temperature grade ensures high reliability and performance in demanding conditions.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it offers optimized performance for specific control tasks while supporting diverse functionalities.

RAM Bytes: 32768

32KB of RAM provides sufficient temporary storage for processing data and managing operations, beneficial for complex applications.

Technology: CMOS

CMOS technology contributes to lower power consumption and higher density, making the microcontroller efficient and compact.

Terminal Form: GULL WING

The gull wing terminal form offers ease of soldering and better thermal performance, important for reliability.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard in many electronic systems, ensuring compatibility and ease of use.

PWM Channels: YES

PWM capabilities enhance control over motor speeds and lighting, crucial for numerous embedded applications.

ROM Programmability: FLASH

Flash ROM allows for reprogrammability, enabling easy updates and modifications to firmware without hardware changes.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm facilitates better space optimization on PCBs, essential for high-density designs.

Speed: 40 rpm

With a capable processing speed of 40 rpm, it can handle various tasks efficiently without bottlenecks.

No. of I/O Lines: 46

Having 46 I/O lines allows for extensive interfacing with sensors, displays, and other components, making it highly versatile.

Technical Specifications

Microcontrollers UPSD3354D-40U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

12

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3/e4

Length:

12 mm

No. of I/O Lines:

46

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

UPSD3354D-40U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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