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UPSD3354D-40T6

STMicroelectronics

UPSD3354D-40T6 by STMicroelectronics

UPSD3354D-40T6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates at up to 40 MHz. It features 262,144 ROM words and supports ADC/PWM channels, making it ideal for industrial applications. Its compact flatpack design ensures efficient space utilization in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 13,370 parts In-Stock

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13,370

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Anansix

USA . 1,314 parts In-Stock

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1,314

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Digiode

USA . 604 parts In-Stock

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604

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ComSIT Distribution GmbH

Germany . 4 parts In-Stock

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4

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ComSIT USA

USA . 4 parts In-Stock

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4

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Prism Electronics

USA . 2 parts In-Stock

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2

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Distributors (Availability)

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Microchip USA

USA . 114 parts In-Stock

1+ parts

$6.404

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114

$6.404

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AZTECH Wire

Italy . 784 parts In-Stock

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$17.460

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784

$17.460

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IDEA Electronic Components Group

UK . 643 parts In-Stock

1+ parts

$39.319

100+ parts

-

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$35.387

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643

$39.319

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$35.387

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MKK Technologies

India . 66 parts In-Stock

1+ parts

$73.937

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66

$73.937

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DigiPath Technology Company

USA . 66 parts In-Stock

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$73.937

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66

$73.937

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Component Stockers USA

USA . 679 parts In-Stock

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$99.990

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679

$99.990

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Vigor

Singapore . 5,917 parts In-Stock

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5,917

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Corphita

USA . 3,680 parts In-Stock

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3,680

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Parana Technologies

USA . 474 parts In-Stock

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$47.012

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474

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$47.012

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Perfect Parts

USA . 2 parts In-Stock

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Overview

Elevate your projects with the UPSD3354D-40T6 microcontroller from STMicroelectronics, a leader in innovation and reliability. Engineered for exceptional performance in diverse applications, this 8-bit powerhouse offers low-profile design and robust temperature resilience, ensuring seamless operation even in challenging environments. With advanced features like ADC and PWM channels, this versatile component enhances efficiency while simplifying development, making it the ideal choice for your next groundbreaking solution. Experience unmatched quality and support from a trusted manufacturer that puts your success first!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable, the plastic/epoxy body material provides good insulation and protects the microcontroller from environmental factors.

Surface Mount: YES

Surface mount technology enables compact design and efficient manufacturing processes, making it suitable for high-density applications.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options while ensuring that the microcontroller operates safely within its voltage rating.

Package Shape: SQUARE

The square shape aids in space-efficient PCB layouts, making it suitable for various applications where board real estate is a concern.

Bit Size: 8

An 8-bit architecture makes it ideal for simple control tasks while maintaining efficiency in processing.

Power Supplies (V): 3.3, 5

Compatibility with multiple voltage levels enhances flexibility in design and helps integrate with different systems.

No. of Terminals: 52

A higher number of terminals allows for more I/O connections, enabling complex projects and greater functionality.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile package style is advantageous for applications with height restrictions, aiding in compact designs.

Minimum Supply Voltage: 4.5 V

This competitive minimum supply voltage allows for wider battery compatibility and lower power consumption.

Maximum Operating Temperature: 85 °C

Operating at higher temperatures makes this microcontroller suitable for industrial applications where thermal resistivity is essential.

CPU Family: 8051

The well-established 8051 family offers a vast ecosystem of tools and libraries, streamlining development and reducing time to market.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures enhances reliability in extreme environmental conditions, ideal for outdoor or automotive applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish ensures excellent conductivity and resistance to corrosion, increasing the microcontroller's lifespan.

ADC Channels: YES

Built-in ADC channels enable analog signal processing directly on the microcontroller, reducing the need for additional components.

Terminal Position: QUAD

Quad terminal positions facilitate better mounting stability and integration with various board layouts.

ROM Words: 262144

Sufficient ROM allows for substantial program storage, accommodating complex algorithms necessary for advanced applications.

Maximum Seated Height: 1.7 mm

A low seated height contributes to a compact design, which is critical in space-constrained applications.

Width: 10 mm

The compact width allows for versatile board designs, making it easy to fit into various electronic projects.

Maximum Clock Frequency: 40 MHz

A high clock frequency provides enhanced processing speeds, enabling the microcontroller to handle time-sensitive tasks efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for consistent solder joint quality during manufacturing, enhancing reliability of the final product.

Peak Reflow Temperature °C: 260

Higher reflow temperatures ensure proper soldering of components, maintaining assembly integrity during production.

Length: 10 mm

A compact length contributes to efficient use of PCB space, ideal for tight assembly conditions.

Temperature Grade: INDUSTRIAL

Grade-rated for industrial applications ensures durability and reliability in demanding environments, making it suitable for long-term use.

Peripheral IC Type: MICROCONTROLLER

Integration of a microcontroller type peripheral allows for a wide range of applications and versatility in embedded systems design.

RAM Bytes: 32768

Ample RAM size permits more data manipulation and complex processing, enhancing performance in memory-intensive tasks.

Technology: CMOS

CMOS technology offers low power consumption, making it suitable for battery-operated and energy-efficient applications.

Terminal Form: GULL WING

The gull wing form factor allows for simple and secure mounting on PCBs, leading to easier assembly and maintenance.

Nominal Supply Voltage: 5 V

A standard nominal supply voltage simplifies design and integration with widely available power sources.

PWM Channels: YES

Included PWM channels facilitate control of motors and other devices, making it versatile for various automation tasks.

ROM Programmability: FLASH

FLASH programmability allows for easy updates and modifications, offering flexibility in applications needing frequent reprogramming.

Terminal Pitch: 0.65 mm

A small terminal pitch enables tighter layouts and denser PCBs, crucial for modern compact device designs.

Moisture Sensitivity Level (MSL): 3

A moderate moisture sensitivity level indicates reasonable handling requirements, making it suitable for various manufacturing processes.

Speed: 40 rpm

An operational speed of 40 rpm is adequate for many processing tasks while maintaining efficient energy use.

No. of I/O Lines: 37

A high number of I/O lines offers extensive connectivity and interfacing options for peripheral devices, adding to design flexibility.

Technical Specifications

Microcontrollers UPSD3354D-40T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

37

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

UPSD3354D-40T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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